Photonic integrated circuits that use light instead of electricity for computing and signal processing promise greater speed, increased bandwidth, and greater energy efficiency than traditional circuits using electricity.
STMicroelectronics Expands Access to Market-Unique LoRa-Enabled STM32WL SoC with 48-Pin Package Option
STMicroelectronics has added a QFN48 package to the award-winning STM32WLE5* wireless System-on-Chip (SoC) portfolio, bringing the device’s extensive feature integration, power efficiency, and multi-modulation flexibility to a wider variety of industrial wireless applications.
Olympus and Lavender International Collaborate to Support Advanced NDT Training
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, has provided its new OmniScan X3 phased array flaw detectors with FMC/TFM to Lavender International’s US facility to support their advanced training courses.
Kneron Unveils Next-Gen AI Chip — No Compromise AI For Smart Devices
Kneron, the San Diego-based edge AI solutions provider backed by the likes of Alibaba, Sequoia, Horizons Ventures, Qualcomm, and SparkLabs Taipei, today announces its new state of the art AI chip: the Kneron KL720.
Cerebras Systems Expands Global Footprint with Toronto Office Opening
Cerebras Systems, the pioneer in accelerating artificial intelligence (AI) compute, today announced its international expansion in Canada with the opening of its Toronto office.
Research Shows Thin-Film Lithium Niobate Photonic Integrated Circuits are Fundamentally Scalable and Highly Cost-Effective, Ideal for Use in Telecommunications and Quantum Computing
Scientists from HyperLight, a leader in the commercialization of lithium niobate (LN) integrated optical circuits, have teamed with Harvard University researchers to achieve a significant technical milestone for photonic integrated circuits (PICs).
Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions
Cadence Design Systems, Inc. today announced the certification of the Cadence tools in TSMC reference flows for TSMC’s latest InFO and CoWoS advanced packaging solutions, the Integrated Fan-Out with RDL interconnect (InFO-R) and Chip-on-Wafer-on-Substrate with silicon interposer (CoWoS-S).
Intel Collaborates with Argonne National Laboratory, DOE in Q-NEXT Quantum Computing Research
Intel today announced that it is among the leading U.S. quantum technology companies included in Q-NEXT, one of five new national quantum research centers established by the White House Office of Science and Technology Policy (OSTP) and the U.S. Department of Energy (DOE).
Keysight Survey Reveals True Costs of Time Delays Caused by Test Equipment Misconfiguration, Maintenance and Training Issues
Keysight Technologies, Inc. has released the results of a third-party survey, conducted by Dimensional Research, that shows nearly all companies who design and develop electronic products, experience costly and preventable delays related to test equipment misconfiguration, maintenance or training issues.
Managing and Influencing Sub-Fab Safety – Developing a Culture of Safety
By Alan Ifould, Edwards Vacuum In a recent webcast at SESHA 2020, the high-tech industry’s international environmental, health, and safety association, Alan Ifould, with input from Richard Meredith, Edwards’ senior manager for safety, health, and environment, explored several scenarios for driving continual improvement in sub-fab safety.
