Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process

CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.

GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition

GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.

Bipartisan, Bicameral Bill Will Help Bring Production of Semiconductors, Critical to National Security, Back to U.S.

U.S. Sen. Mark R. Warner (D-VA), Vice Chairman of the Senate Select Committee on Intelligence, and Sen. John Cornyn (R-TX) introduced the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act.

NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform

NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.

SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.

The bipartisan legislation would improve the competitiveness of semiconductor research, design and manufacturing in the United States, resulting in the creation of thousands of new jobs and bolstering national security.

Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure

Towards application of materials informatics to development of thermal functional materials.

Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact

Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.

Greg Waters joins Mythic Board of Directors

Mythic, an innovative AI inference processor company with breakthrough analog compute-in-memory technology, today announced that Greg Waters has joined the company’s board of directors.

Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process

Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology.

Deep Learning Robotics Granted New Patent from U.S. Patent Office for Robotic Learning

Deep Learning Robotics Ltd., a leading technology company focused on robotics and automation solutions, announced that the United States Patent and Trademark Office has granted the company a new patent, No. US10,571,896.