Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel.
This Screen Stores and Displays Encrypted Images Without Electronics
It uses magnetic fields to display images at the same resolution as a squid’s color-changing skin.
Joachim Kunkel Joins Arteris Board of Directors
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Joachim Kunkel will join its Board of Directors.
North Carolina State University Orders Ion Beam Etching Equipment from scia Systems
The scia Mill 200 system provides highly precise surface structuring of thin films with enhanced selectivity.
Microelectronics Commons Announcement Event
The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) dedicated to advancing microelectronics across the Northeast, will host Department of Defense and White House officials to publicly announce the first multimillion-dollar project awards under the Microelectronics Commons program.
Purdue Deep-Learning Innovation Secures Semiconductors Against Counterfeit Chips
RAPTOR technology exceeds the performance of traditional tampering detection methods by up to 40%.
TD Shepherd Joins the Silicon Catalyst In-Kind Partner Ecosystem
Silicon Catalyst IKPs provide technical and business support to the Portfolio Companies in the incubator + accelerator, enabling them to tap into the products and services available to enhance the growth of their companies.
Arm Announces Appointment of Young Sohn to its Board of Directors
Arm today announced the appointment of new Board member Young Sohn.
SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
SkyWater Technology today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
