Cobham Advanced Electronic Solutions (CAES), a provider of mission critical electronic solutions, announces the appointment of Mike Kahn as Chief Executive Officer (CEO) effective September 1, 2020. Mike takes over from Shawn Black, who is leaving the business to pursue other opportunities.
MagnaChip Completes Sale of Foundry Services Group and Fab 4
MagnaChip Semiconductor Corporation announced that certain of its wholly owned subsidiaries have completed the previously announced sale of the Company’s Foundry Services Group and the factory in Cheongju to Key Foundry Co., Ltd.
Samsung Begins Mass Production of 16Gb LPDDR5 DRAM at World’s Largest Semiconductor Line
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry’s first 16-gigabit (Gb) LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology.
Team’s Flexible Micro LEDs May Reshape Future of Wearable Technology
University of Texas at Dallas researchers and their international colleagues have developed a method to create micro LEDs that can be folded, twisted, cut and stuck to different surfaces.
Virtual MSEC 2020 to Spotlight MEMS and Sensor Innovations for Medical, Smart Cities, Other Growth Markets
Staged for the first time in virtual format, MEMS and Sensors Executive Conference (MSEC 2020) will gather industry visionaries and experts October 6-15 for the latest trends and innovations in sensorization for growth markets including medical, entertainment, augmented and virtual reality, the environment, food production, smart cities, ultrasonics and wearables.
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
ZEISS today introduced the Advanced Reconstruction Toolbox for its industry-leading Xradia Versa series of non-destructive 3D X-ray microscopes (XRM) and its Xradia Context 3D X-ray micro-computed tomography (microCT) systems.
CMP Consumables US$2.5B in 2020 for IC Fabs
TECHCET announces that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is expected to total over US$2.5 billion this year.
Worldwide Spending on Artificial Intelligence Is Expected to Double in Four Years, Reaching $110 Billion in 2024, According to New IDC Spending Guide
Global spending on artificial intelligence (AI) is forecast to double over the next four years, growing from $50.1 billion in 2020 to more than $110 billion in 2024.
KIOXIA Launches First PCIe Gen4 NVMe U.3 SSDs for HPE Servers
KIOXIA America, Inc., is the first1supplier to launch PCIe Gen4 NVM Express (NVMe) data center-class solid-state drives (SSDs) within the HPE NVMe mainstream performance SSD portfolio available on HPE ProLiant, HPE Synergy and HPE Apollo servers.
Changes to Bosch Rexroth Management in North America
Paul Cooke, President and CEO of Bosch Rexroth North America, based in Charlotte, NC, USA, will retire on December 31, 2020 after 38 years of distinguished service in various international positions within Bosch Rexroth.
