Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SEMI Statement on New U.S. Export Control Regulations

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.

Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan

Trymax Semiconductor Equipment BV, a global leader in semiconductor plasma technology, and Scientech Corporation, announced today that they have entered into a distribution agreement for Taiwan. The agreement gives Scientech Corporation the right to distribute all of Trymax’s NEO ashing, etching products and their latest UV curing and charge erase products.

Sensata Technologies Appoints New General Manager for Aftermarket Business Unit

Sensata Technologies, a global industrial technology company and a leading provider of sensor-rich solutions, is pleased to announce the appointment of Russ Stebbins as General Manager of the Global Aftermarket Business Unit. Russ’s appointment plays a critical role in supporting Sensata’s continual growth strategy and driving its leadership position in the automotive aftermarket.

High-Function Polyol Additives Improve Performance of Electronics Adhesives

Adhesives used in electronics assemblies must perform without fail to protect delicate components from vibration and heat. They must also be able to secure the components without interfering with the operation of the end product.

Monzukuri Unveils First Commercially-Available IC/Package Co-Design Tool

Monozukuri S.p.A, today unveiled GENIO, the first commercially available IC/Package Co-Design Tool. The company said that it is able to take orders for GENIO now. GENIO is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.

STMicroelectronics Launches High-Accuracy Inclinometer with Machine-Learning Core

The IIS2ICLX from STMicroelectronics is a high-accuracy, low-power, 2-axis digital inclinometer for use in applications such as industrial automation and structural-health monitoring. It features a programmable machine-learning core and 16 independent programmable finite state machines that help edge devices save power and reduce data transfers to the cloud.

Consumer Electronics Market is Set to Surpass $1,500B by 2026

According to a recent study from market research firm Global Market Insights, the demand for consumer electronics market is anticipated to grow at a significant rate on account of increasing purchase of devices integrated with latest technologies.

SkyWater President Thomas Sonderman to Deliver Keynote at 2020 Virtual Advanced Semiconductor Manufacturing Conference (ASMC)

SkyWater Technology today announced the company’s President, Thomas Sonderman will present a keynote address, “Manufacturing Leadership in the Era of Artificial Intelligence,” at the 2020 virtual Advanced Semiconductor Manufacturing Conference (ASMC) at 9:00 am EDT on August 24th.

TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries

TrendForce provides the following analyses on the impacts that the expanded sanctions against Huawei have on five tech industries, including semiconductors, memory products, smartphones, display panels, and 5G communications.

Subaru Selects Xilinx to Power New-Generation EyeSight System

Xilinx, Inc. (NASDAQ: XLNX) today announced that its technology is powering the new version of Subaru’s vision-based advanced driver-assistance system (ADAS), EyeSight.