Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Siemens Acquires Avatar, Expands EDA Footprint with Innovative Place and Route Technology

Siemens has signed an agreement to acquire Santa Clara, CA-based Avatar Integrated Systems Inc., a leading developer of place and route software for integrated circuit (IC) design. Avatar helps engineers optimize power, performance, and area (PPA) for complex chips with fewer resources.

Microtronic Announces Real-time Macro Defect Monitoring – Within Semiconductor Processing Equipment

Microtronic, maker of high-speed full-wafer macro defect inspection systems and software, has just announced an innovative new way to automatically detect and manage wafer processing defects, beginning at the source – from inside specific types of processing tools.

Graphene-Adsorbate van der Waals Bonding Memory Inspires ‘Smart’ Graphene Sensors

Monolayer graphene, an atomic-layer thick sheet of carbon has found immense applications in diverse fields including chemical sensors, detecting single molecule adsorption events electronically.

STMicroelectronics Makes Acquisitions to Further Strengthen the Wireless Connectivity Capabilities of STM32 Microcontrollers

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the signing of two M&A agreements related to the acquisitions of the entire share capital of Ultra Wide Band specialist BeSpoon and of the cellular IoT connectivity assets of Riot Micro.

Festo Lowers Wafer Oxidation Risk with New N2 Purge System

The new Festo N2 purge system for silicon wafer manufacture significantly reduces the risk of oxidation caused by particle contamination. This Festo system is ideal for Front Opening Unified Pod (FOUP) applications by maintaining a consistent, low-particle nitrogen supply. It is the latest Festo innovation for automation in the semiconductor industry.

Technological Advancements Adding New Feathers of Growth to Electronic Health Records Market

The advantages stitched to the electronic health records such as improved precision and extraordinary efficiency may bring transformational growth for the electronic health records market during the forecast period of 2017-2025. Furthermore, the growing threat of SARS-CoV-2 is anticipated to add extra stars of growth to the electronic health records market.

MagnaChip Expands High Frame Rate DDIC Product Line for OLED Smartphone Displays

MagnaChip Semiconductor Corporation announced an expansion of the company’s High Frame Rate (HFR) OLED DDIC product line for smartphones with the introduction of new DDIC products.

Micron Drives DDR5 Adoption With Technology Enablement Program

Micron Technology, Inc. (Nasdaq: MU), today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

New Organic Material Unlocks Faster and More Flexible Electronic Devices

Mobile phones and other electronic devices made from an organic material that is thin, bendable and more powerful are now a step closer thanks to new research led by scientists at The Australian University (ANU).

Tech to Help Autonomous Vehicles Better Scan for Nearby Fast-Moving Objects

A self-driving car has a hard time recognizing the difference between a toddler and a brown bag that suddenly appears into view because of limitations in how it senses objects using lidar.