Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

North American Semiconductor Equipment Industry Posts July 2020 Billings

North America-based manufacturers of semiconductor equipment posted $2.60 billion in billings worldwide in July 2020 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 11.8 percent higher than the final June 2020 level of $2.32 billion, and is 27.6 percent higher than the July 2019 billings level of $2.03 billion.

Semtech Collaborates with AWS and TensorIoT to Simplify IoT Solution Development

Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced it is collaborating with Amazon Web Services (AWS) and TensorIoT to simplify Internet of Things (IoT) solution development by offering Asset Tracking and Smart Building Kits that integrate Semtech’s LoRa® devices and the LoRaWAN® protocol with AWS IoT services.

Alpha and Omega Semiconductor Announces a New High SOA MOSFET for 12V Hot Swap Applications

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer and global supplier of a broad range of power semiconductors, power ICs, and Digital Power products today announced the release of, AONS32310, a 30V MOSFET with low on-resistance and a high Safe Operating Area (SOA) capability which is ideally suited for demanding applications such as hot swap and effuse.

Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation

Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA’s Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA’s programs to quickly and easily take advantage of Arm’s leading IP, tools and support, accelerating innovation in a variety of fields.

Silicon Creations Achieves ISO 9001 Certification for World-Class Silicon IP Development Process

Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced today that the company has achieved ISO 9001 Quality Management System certification by the British Standards Institute (BSI), one of the world’s largest certification bodies.

Trapping and Controlling Light at the Interface of Atomically Thin Nanomaterials

Scientists at Cornell University propose a new method to confine light in an atomically thin graphene layer by leveraging topological phenomena that occur at the interface of specially designed nanomaterials.

Tech Innovation to Improve Resiliency and Agility Will Be Critical Post-COVID-19, Says Lux Research

COVID-19 has drastically changed the landscape for businesses across all industries, forcing immediate changes – but ones that will have long-term consequences. In the latest report by Lux Research, “The Impact of COVID-19 on Tech Innovation,” Lux outlines five key trends that will define how the world beyond the pandemic will be different.

Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1

The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors were $34.5 billion in June 2020, an increase of 5.1 percent from the June 2019 total of $32.9 billion.

S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification

S2C and Mirabilis Design today announced the collaboration and delivery of a hybrid SoC architecture exploration solution that reuses available RTL-based blocks to accelerate model construction and speed-up very complex simulations. The collaboration enables design projects that deploy model-based design methodology to further reduce the time and effort spent on creating complicated custom models of legacy designs.

Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology

Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced the availability of its well-established sensing fabric on TSMC’s industry-leading N6 process technology.