Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Production of Disinfectants with Busch Vacuum Technology

The demand for disinfectants is constantly increasing due to the hygienic measures in the fight against COVID-19. Chemical companies all over the world expanded their production capacities or even switched to the production of the urgently needed disinfectants.

From Generation to Generation: 3 Challenges in Building Platformed Product Lines

This concept of product-platforming isn’t unique to the automotive industry. Many electronics manufacturers also need to efficiently support a range of products and product-variants, and have also turned to scalable, reusable platform designs to maximize efficiency and product margins.

Aspinity and Infineon Partner to Accelerate Development of Intelligent Sensing Products with Longer-Lasting Batteries

Aspinity, a pioneer in power-efficient analog edge processing, today announced a partnership with Infineon Technologies AG that will speed development of battery-operated always-on sensing products for consumer and Internet of Things (IoT) applications.

Cartesiam Optimizes NanoEdge AI Studio for STMicroelectronics STM32 Development Boards

Cartesiam, a company that creates artificial intelligence (AI) software for embedded systems, announces a new release of its NanoEdge™ AI Studio optimized for the market-leading STM32 microcontroller development boards of STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

Picosun and A*STAR’s IME to Create Novel, High Performance Memories

Picosun Group, provider of the leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, and A*STAR’s Institute of Microelectronics (IME), Singapore, strengthen their collaboration in next generation memory technologies.

NRL Researchers Create Electronic Diodes Beyond 5G Performance

David Storm, a research physicist, and Tyler Growden, an electrical engineer, both with the U.S. Naval Research Laboratory, developed a new gallium nitride-based electrical component called a resonant tunneling diode (RTD) with performance beyond the anticipated speed of 5G.

Infosys Selected as the Digital Transformation Partner for GLOBALFOUNDRIES’ Digital Leadership Program

Infosys (NYSE: INFY), a global leader in next-generation digital services and consulting, has been selected by GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, as its partner for the company’s Digital Transformation program. Through this partnership, Infosys will provide expertise and analytical solutions to optimize the overall efficiency and agility of GF’s manufacturing and business operations.

Ereztech Expands US Footprint; Opens Precursor R&D Lab and Adds Domestic Manufacturing Capability

Ereztech, a leading provider of complete metal-organic solutions to the semiconductor industry, today announced the opening of its new research and development (R&D) lab in Sheboygan Falls, Wisconsin.

Keysight Technologies’ Combines Technology and Solutions Expertise to Deliver the New Infiniium MXR-Series Mixed Signal Oscilloscopes

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced the first oscilloscope with 8 analog channels at 6 GHz and 16 simultaneous digital channels, enabling customers to reduce test bench and workflow complexity to achieve higher performance as well as accurate and repeatable multi-channel measurements in a single instrument.

Samsung Unveils Innovative Storage Technology at OCP Virtual Global Summit

Samsung announced today in an OCP Virtual Summit keynote that it has developed a solid state drive (PM9A3 SSD) with a SNIA-based* E1.S form factor and full PCIe Gen 4 support to harness the production efficiencies of the company’s sixth-generation (1xx-layer), three-bit V-NAND. At the same time, the company said that it has introduced a comprehensive reference design for its E1.S-based storage system.