FlexEnable today announced that the world’s first mass-produced consumer product incorporating organic transistor technology has started shipping.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
TopLine Corporation announces the introduction of braided solder columns as a drop-in replacement for solder spheres used in Ball Grid Array (BGA) components.
NY CREATES and Korea’s National Nano Fab Center Announce Research Partnership to Develop Joint Technology Hub
NY CREATES and the National Nano Fab Center announced a partnership which aims to develop a shared hub for enabling joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s respective high-tech ecosystem.
IDTechEx Summarizes the Emerging Adoption and Future Trends of SiC and GaN in EVs
In 2008, the commercialization of the silicon carbide (SiC) MOSFET marked a major turning point for the power semiconductor market, representing its first significant development in decades.
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Technology (OPENEDGES).
pSemi Joins the Connectivity Standards Alliance to Shape the Future of IoT
pSemi Corporation today announced that it, alongside its parent company Murata, has expanded its role to “Participant” level with The Connectivity Standards Alliance (CSA), an international community of more than 675 technology companies committed to open standards for the Internet of Things (IoT).
Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
Synopsys, Inc. today announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry’s SF2 process with multiple test chip tapeouts.
High-end O-Rings to Grow 2x Faster than Wafer Starts
FFKM O-Rings remains low-risk pathway for semiconductor manufacturing.
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX).
