This week at the 2020 Symposia on VLSI Technology and Circuits, Intel will present a body of research and technical perspectives on the computing transformation driven by data that is increasingly distributed across the core, edge and endpoints.
Dow Introduces Easy-to-Dispense Gap Filler with Strong Thermal Conductivity and Slump Resistance for Efficient Assembly
Dow introduced today new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.
GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.
Bipartisan, Bicameral Bill Will Help Bring Production of Semiconductors, Critical to National Security, Back to U.S.
U.S. Sen. Mark R. Warner (D-VA), Vice Chairman of the Senate Select Committee on Intelligence, and Sen. John Cornyn (R-TX) introduced the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act.
NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform
NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.
SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.
The bipartisan legislation would improve the competitiveness of semiconductor research, design and manufacturing in the United States, resulting in the creation of thousands of new jobs and bolstering national security.
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Towards application of materials informatics to development of thermal functional materials.
Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact
Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.
Greg Waters joins Mythic Board of Directors
Mythic, an innovative AI inference processor company with breakthrough analog compute-in-memory technology, today announced that Greg Waters has joined the company’s board of directors.
