CEA-Leti today announced its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC) using a single GaN blue micro- light-emitting diode (LED).
COVID-19 Triggers Accelerated Shift to Digital Technologies and Services
The ongoing digital transformation of business and society has been shifted into overdrive by the COVID-19 pandemic, triggering major changes in key segments ranging from online services, to capital spending, to the cloud, to the electronics supply chain.
Paragraf Partners with CERN to Demonstrate Unique Properties of Paragraf’s New Graphene Hall Effect Sensor
Paragraf has embarked on a working partnership with the Magnetic Measurement section at CERN, the European Organization for Nuclear Research, to demonstrate how new opportunities for magnetic measurements are opened up through the unique properties of its graphene sensor, particularly its negligible planar Hall effect.
Strategy Analytics: Huawei Sanctions Bad for US Economy & Semiconductor Competiveness
Strategy Analytics today said that the new U.S. Government policy announced in May 2020 against Huawei threatens U.S. semiconductor industry exports, innovation, and global leadership.
Global AI Edge Chipset Revenue to Reach $51.9B by 2025, Driven by the Increasing Need for AI Inference at the Edge, According to Omdia
The need for artificial intelligence (AI) on edge devices has been realized and the race to design edge-optimized chipsets has begun. According to new research from Omdia, AI processing on the edge device circumvents privacy concerns while avoiding the bandwidth, latency, and cost concerns of cloud computing.
DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA
DSP Group, Inc., a leading global provider of wireless chipset solutions for converged communications, announced the acquisition of privately owned SoundChip SA, a leading supplier of active noise cancellation (ANC) technology, engineering services, design tools, and production-line test systems for headsets.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.
Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
Xperi Holding Corporation and Tower Semiconductor, a global leader in high-value analog semiconductor foundry solutions, today announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies.
StratEdge Expands Production Capacity of its RF Packaging Line
StratEdge Corporation announces the expansion of its production line for building ceramic and molded ceramic packages to support 5G infrastructure demands.
