SUSS MicroTec and DELO cooperate in the optimization of imprint manufacturing processes for the production of wafer-level optics (WLO). These optics are essential for emerging applications in the automotive and consumer electronics industries, among others.
AKHAN Semiconductor’s Latest US Patent Addresses Diamond Film for Consumer Electronic Displays
AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today that it has been issued a patent by the United States Patent Office (USPTO) generally related to systems and methods for transparent diamond electronics.
Producing Technicolor Through Brain-Like Electronic Devices
Structural coloration is promised to be the display technology of the future as there is no fading – it does not use dyes – and enables low-power displays without strong external light source. However, the disadvantage of this technique is that once a device is made, it is impossible to change its properties so the reproducible colors remain fixed. Recently, a POSTECH research team has successfully obtained vivid colors by using semiconductor chips – not dyes – made by mimicking the human brain structure.
Tachyum Opens U.S., EU and NATO Government Business Unit
Tachyum Inc. today announced it is opening a business unit to serve U.S., EU and NATO member Government customers of its Prodigy Universal Processor for demanding HPC, artificial intelligence and machine learning workloads.
Inkron Invests in Augmented Reality Components Development Infrastructure
Inkron, a Nagase Group Company, the global leader of siloxane-based, optically clear Nano-Imprint Lithography (NIL) materials, makes a strategic investment in NIL materials and components development infrastructure.
Semiconductor Manufacturing Equipment Market is Projected to Reach USD 80 billion by 2026
According to a recent study from market research firm Global Market Insights, The adoption of technologies like AI and IoT in fabrication will significantly impact the semiconductor manufacturing equipment market forecast. Software companies are keen on implementing advanced solutions to cater to the rising demands of compact chipsets and growing production.
BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program
BrainChip Holdings Ltd, a leading provider of ultra-low power high performance AI technology, today announced that VORAGO Technologies has signed the Akida Early Access Program Agreement.
Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP
Cadence Design Systems, Inc. today announced that Kneron, a leading provider of on-device edge AI solutions, has integrated the Cadence Tensilica Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications.
Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems
CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
CEA-Leti X-Ray Photon-Counting Detector Modules Target Improved Medical Diagnoses
A novel X-ray photon-counting detector module (PCDM) developed by CEA-Leti and integrated in an X-ray scanner prototype from Siemens Healthineers has shown in clinical trials the potential to revolutionize computed-tomography (CT) scanning by potentially increasing spatial resolution, reducing X-ray exposure to patients, improving image quality by lowering image noise and artifacts, and by distinguishing multiple contrast agents.
