Scientists around the world are intensively working on memristive devices, which are capable in extremely low power operation and behave similarly to neurons in the brain. Researchers from the Jülich Aachen Research Alliance (JARA) and the German technology group Heraeus have now discovered how to systematically control the functional behaviour of these elements.
Heilind Electronics and Laird Performance Materials Sign Global Distribution Agreement
Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International.
Pfeiffer Vacuum Supplies Turbopumps for GANIL Large-Scale Research Facility in France
Pfeiffer Vacuum has received several major orders from the French large-scale research facility GANIL (Grand Accélérateur National d’Ions Lourds) (National Large Heavy Ion Accelerator) for the supply of turbopumps and custom vacuum chambers.
Pure Wafer Expands Production Capacity at AZ and CA Facilities Announces New Films Services Group to Meet Semi R&D Needs
Pure Wafer, America’s leading provider of reclaimed wafers and thin films services to the semiconductor manufacturing industry announced today that it has expanded production at its Arizona and California facilities.
Unified Programming Model Critical to Uncompromised Application Performance, Saves Time and Money, Study Finds
New computing accelerators are rapidly emerging, and organizations need to examine time and financial considerations associated with developing performance-sensitive applications that can run on both new and existing computing platforms.
MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Rollouts
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI RF Front End Control Interface (MIPI RFFE) v3.0. The latest version of the world’s de facto standard interface for control of radio frequency (RF) front-end (FE) subsystems, MIPI RFFE v3.0 is designed to deliver the tighter timing precision and reduced latencies that manufacturers need today to advance the rollout of 5G around the world.
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. and Universal Display Corporation Enter into Long-Term OLED Agreements
Universal Display Corporation (Nasdaq: OLED), enabling energy-efficient displays and lighting with its UniversalPHOLED® technology and materials, and Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (华星光电), today announced the signing of a new OLED Technology License Agreement and Supplemental Material Purchase Agreement.
Nordson Corporation Names Joseph P. Kelley as Chief Financial Officer
Nordson Corporation (NASDAQ-NDSN) today announced that Joseph P. Kelley has been named Executive Vice President and Chief Financial Officer, effective July 6, 2020. Mr. Kelley succeeds Gregory A. Thaxton, who previously announced his plans to retire. Upon Mr. Kelley’s start date, Mr. Thaxton will become Executive Vice President to the Company until he retires on August 28, 2020.
Memory Market Not Forecast to Exceed 2018 High of $163.3B until 2022
The most current 2017-2024 forecast for 35 major IC product segments (e.g., DRAM, 16-bit MCUs, power management analog devices, etc.) by market, unit shipments, and ASP was presented in the April Update to the 2020 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (MR20).
2D Oxide Flakes Pick Up Surprise Electrical Properties
Rice University researchers have found evidence of piezoelectricity in lab-grown, two-dimensional flakes of molybdenum dioxide. Their investigation showed the surprise electrical properties are due to electrons trapped in defects throughout the material, which is less than 10 nanometers thick.
