Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has received UL’s Zero Waste to Landfill validation of Gold level and above for all of its global semiconductor operation sites.
Flexible and Recyclable Optoelectronics Move a Step Closer
Australian researchers have demonstrated the strong potential for a new type of flexible, recyclable electrodes to be used in creating cheaper solar cells, touchscreens, wearable ‘e-skins’ and next-generation responsive windows.
CEA-Leti Researchers Break Throughput Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
CEA-Leti today announced its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC) using a single GaN blue micro- light-emitting diode (LED).
COVID-19 Triggers Accelerated Shift to Digital Technologies and Services
The ongoing digital transformation of business and society has been shifted into overdrive by the COVID-19 pandemic, triggering major changes in key segments ranging from online services, to capital spending, to the cloud, to the electronics supply chain.
Paragraf Partners with CERN to Demonstrate Unique Properties of Paragraf’s New Graphene Hall Effect Sensor
Paragraf has embarked on a working partnership with the Magnetic Measurement section at CERN, the European Organization for Nuclear Research, to demonstrate how new opportunities for magnetic measurements are opened up through the unique properties of its graphene sensor, particularly its negligible planar Hall effect.
Strategy Analytics: Huawei Sanctions Bad for US Economy & Semiconductor Competiveness
Strategy Analytics today said that the new U.S. Government policy announced in May 2020 against Huawei threatens U.S. semiconductor industry exports, innovation, and global leadership.
Global AI Edge Chipset Revenue to Reach $51.9B by 2025, Driven by the Increasing Need for AI Inference at the Edge, According to Omdia
The need for artificial intelligence (AI) on edge devices has been realized and the race to design edge-optimized chipsets has begun. According to new research from Omdia, AI processing on the edge device circumvents privacy concerns while avoiding the bandwidth, latency, and cost concerns of cloud computing.
DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA
DSP Group, Inc., a leading global provider of wireless chipset solutions for converged communications, announced the acquisition of privately owned SoundChip SA, a leading supplier of active noise cancellation (ANC) technology, engineering services, design tools, and production-line test systems for headsets.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.
