GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the company is entering the wireless earphone market with the introduction of a new MOSFET for wireless earphones for preventing the battery from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.
Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020
Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4-7, 2020, in Saratoga Springs, New York. Registration is now open.
Roger Grace Announces Call for Abstracts
Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS, has announced the call for abstracts for the all-day June 22, 2020 Pre-Conference Symposium during Sensors Expo & Conference, taking place at the McEnery Convention Center in San Jose, CA. Interested presenters are requested to submit abstracts of between 150-200 words as attached documents no later than March 16, 2020 and sent to Roger Grace, Symposium Chair, at rgrace@rgrace.com.
FLEX and MSTC 2020 Open Today as Flexible Hybrid Electronics Drive Next Wave of Smart MEMS and Sensors
The latest advances in flexible and printed electronics take the spotlight at the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) opening today. FLEX and MSTC 2020 feature keynotes, panels, technical sessions, deep-dive tech talks, networking opportunities and nearly 50 exhibitors with more than 400 attendees. See the full agenda for the four-day events are at the DoubleTree by Hilton Hotel in San Jose, California.
Black Phosphorous Tunnel Field-Effect Transistor as an Alternative Ultra-Low Power Switch?
Researchers have reported a black phosphorus transistor that can be used as an alternative ultra-low power switch. A research team led by Professor Sungjae Cho in the KAIST Department of Physics developed a thickness-controlled black phosphorous tunnel field-effect transistor (TFET) that shows 10-times lower switching power consumption as well as 10,000-times lower standby power consumption than conventional complementary metal-oxide-semiconductor (CMOS) transistors.
Gigaphoton Unveils New Lasers for 2020
Gigaphoton Inc. (Head Office: Oyama, Tochigi; President & CEO: Katsumi Uranaka), a manufacturer of light sources used in semiconductor lithography, announced on February 21, 2020 that it will add two new models to its ArF and KrF product lineups in 2020. The ArF immersion “GT66A” and the KrF “G60K” light sources will bring the very latest technologies to semiconductor lithography manufacturing.
New Version of Si2 oaScript Expands IC Design Capabilities into the Cloud and AI
Design partitioning and multi-threaded parallel execution are key features of the updated scripting interface to OpenAccess, the industry’s most widely used IC design database. oaScript Version 4.0—developed by programming experts in the Silicon Integration Initiative oaScript Working Group—leverages the powerful enhancements available to OpenAccess in its most recent Data Model 6 upgrade.
Silvaco Appoints Howard Hideshima as Chief Financial Officer
Silvaco, Inc., a leading global provider of software, IP, and services to semiconductor companies for the design of ICs, flat panel displays, and electronic systems, today announced the appointment of Howard Hideshima as Chief Financial Officer (CFO).
