Shannon Davis

News and Web Editor

6718 Articles0 Comments

Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

BJG Electronics Group Names Kent Smith as President

New York based BJG Electronics Group announced today that Kent Smith has joined the company as President, effective February 3, 2020. Most recently serving as Chief Commercial Officer for Integrated Supply Network, Smith brings to BJG a track record of successful leadership positions at electronics industry leaders. At Nu Horizons Electronics Corp., he served as President of the Americas and Asia-Pacific. Later, as Vice President of Sales at Arrow Electronics, he led a team that generated more than $4 billion in annual sales.

NRL Researchers’ Golden Touch Enhances Quantum Technology

Scientists at the U.S. Naval Research Laboratory discovered a new platform for quantum technologies by suspending two-dimensional (2-D) crystals over pores in a slab of gold.

Coronavirus Outbreak Can Drastically Impact the Technology Road Map for 2020, says GlobalData

The coronavirus outbreak is now entering a crucial phase with the WHO declaring it as a global health emergency. While the economic impact of the outbreak will be dependent on how long it ultimately lasts, its impact on technology markets across the world is already beginning to come to the fore, says GlobalData, a leading data and analytics company. Several technology companies, including Amazon, Microsoft and Apple have now imposed travel restrictions to and from China, whereas Google has altogether suspended its office operations in mainland China, Hong Kong and Taiwan.

AKHAN Semiconductor Issued Major Patent in United States

AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today that it has been issued a patent by the United States Patent Office (USPTO). The patent covers AKHAN’s new and improved system and method for fabricating monolithically integrated diamond semiconductors.

CyberOptics Introduces New In-Line Particle Sensor as an Extension of the Industry-Leading Particle Sensing Technology at SPIE

CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SPIE Advanced Lithography from February 25-26, 2020 at the San Jose Convention Center in California, booth #308. During the show, the company will introduce its new In-Line Particle Sensor (IPS) with CyberSpectrum software for semiconductor tool set-up and equipment diagnostics.

Kioxia Appoints Nobuo Hayasaka as President and CEO

Kioxia Holdings Corporation today announced that the Board of Directors has appointed Nobuo Hayasaka as President and CEO of Kioxia, effective immediately. Dr. Hayasaka has served as Acting President and CEO since July 12, 2019, during Former President and CEO Yasuo Naruke’s medical leave of absence. Dr. Naruke notified the company’s Board of Directors of his desire to step down as President, CEO and member of the board as he continues to focus on his health.

Hermetically Sealed Semiconductors

Tomorrow’s electronics are getting ever smaller. Researchers are thus searching for tiny components that function reliably in increasingly narrow configurations. Promising elements include the chemical compounds indium selenide (InSe) and gallium selenide (GaSe). In the form of ultra-thin layers, they form two-dimensional (2D) semiconductors. But, so far, they have hardly been used because they degrade when they get in contact with air during manufacturing. Now, a new technique allows the sensitive material to be integrated in electronic components without losing its desired properties. The method, which has been described in the journal ACS Applied Materials and Interfaces (DOI: 10.1021/acsami.9b13442), was developed by Himani Arora, a doctoral candidate of physics at the Helmholtz-Zentrum Dresden-Rossendorf (HZDR).

Cisco Appoints AMD President and CEO Dr. Lisa T. Su to Board of Directors

Cisco today announced the appointment of Dr. Lisa T. Su, AMD president and CEO, to its board of directors effective today. “Lisa is an accomplished business leader with deep expertise in the semiconductor industry,” said Chuck Robbins, chairman and CEO, Cisco. “We look forward to her contributions to Cisco’s board and our business as we continue to develop ground breaking technologies, and a new internet for the 5G era that will help our customers innovate faster than ever before.”

Cree, Inc. Appoints Glenda Dorchak to Board of Directors

Cree, Inc. (Nasdaq: CREE), the global leader in silicon carbide technology, announces that Glenda Dorchak, a seasoned corporate operating executive and experienced director, has been appointed to the Company’s Board of Directors, effective January 27, 2020. Ms. Dorchak has served as a director of Mellanox Technologies, Ltd. (Nasdaq: MLNX) since July 2009. Additionally, she serves as a director of Viavi Solutions Inc. (Nasdaq: VIAV), ANSYS. Inc. (Nasdaq; ANSS), and GlobalFoundries, a private semiconductor foundry.

JEDEC Honors Dr. Howard Yang of Montage Technology With New Award

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that Dr. Howard Yang, co-founder, Chairman and CEO of Montage Technology, is an inaugural recipient of the JEDEC Distinguished Executive Leadership Award. The JEDEC Distinguished Executive Leadership Award honors the most distinguished senior executives in the electronics industry who have promoted and supported the advancement of JEDEC standards. Recipients of this award are making the industry better through their long-term support for JEDEC participation at both the strategic and managerial levels of open standards development.