TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials.
NY CREATES Begins Discussions on New Strategic Relationship With SEMI
The New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY CREATES) today announced discussions to form a new Strategic Engagement with SEMI, the global industry association representing the electronics manufacturing and design supply chain. The announcement was made at the SEMI Industry Strategy Symposium, attended by several hundred C-Level semiconductor executives. Formed as a new and flexible industry interface in New York, NY CREATES is tasked with bridging academic, research, and industry innovation of the advanced electronics sector in New York.
Vitrex plc: Investment to Create a Joint-Venture for PEEK Manufacture in China
Victrex plc today announces the creation of a joint-venture between its subsidiary, Victrex Hong Kong Limited, and Yingkou Xingfu Chemical Company Limited, to build and operate a new PEEK polymer manufacturing facility in Liaoning, China, subject to certain performance conditions, including finalizing land purchase and permit applications. Victrex, which will be the majority partner and lead the joint-venture, will benefit by further differentiating and complementing its portfolio of PEEK and PAEK grades, in anticipation of a range of significant long-term growth opportunities across several end markets in China, as well as aligning with China’s ‘Made in China 2025’ initiative, where specifying domestically produced PEEK in certain applications is expected to gain momentum.
Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Building upon successful 7nm designs, Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence® digital implementation solutions. With these Cadence solutions in place, Broadcom can further augment engineering productivity and improve silicon performance and power.
SEMI ISS 2020: Data Driven Innovation and Growth
The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme Data Driven Innovation and Growth. The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry. For the nearly 300 attendees at ISS 2020, opening day highlighted market and technology opportunities and a reflection on the significant pricing and international trade challenges the semiconductor manufacturing supply chain faced in 2019.
SEMICON Korea 2020 Keynotes to Highlight Future of AI
Semiconductor industry innovators SK hynix, Intel, imec and Graphcore will kick off SEMICON Korea 2020 with keynotes focusing on the future of artificial intelligence (AI) as an estimated 500 companies and 55,000 visitors gather February 5-7 at the COEX in Seoul for the latest microelectronics developments, innovations and trends powering the next wave of industry growth. Themed Design the Smarter Future, SEMICON Korea 2020 will feature more than 30 technology programs offering leading insights into semiconductor manufacturing, AI, MEMS and sensors, mobility, and metrology and inspection.
Solving Complex Problems at the Speed of Light
Many of the most challenging optimization problems encountered in various disciplines of science and engineering, from biology and drug discovery [1] to routing and scheduling [2] can be reduced to NP-complete problems. Intuitively speaking, NP-complete problems are “hard to solve” because the number of operations that must be performed in order to find the solution grows exponentially with the problem size. The ubiquity of NP-complete problems has led to the development of dedicated hardware (such as optical annealing and quantum annealing machines like “D-Wave”) and special algorithms (heuristic algorithms like simulated annealing).
Tuning Optical Resonators Gives Researchers Control Over Transparency
Researchers at the McKelvey School of Engineering at Washington University in St. Louis have devised a fully contained optical resonator system that can be used to turn transparency on and off, allowing for a measure of control that has implications across a wide variety of applications.
EV/HEV Is Driving Power Electronics Innovations
The power electronics sector is pushing to adapt and propose innovative products. Objectives are clearly to answer to the specific needs coming from EV/HEV makers and make sure, for the power electronics companies, to be part of this attractive growth. They are so working on the miniaturization of the components, circuits and system design and are developing new solutions to integrate several systems in one system (e-axle, integration of DC-DC converter with a battery, etc.). Of course, WBG technologies are part of the technology roadmap, especially SiC power devices.
SmartSens Wins Semiconductor Solution of the Year Designation in 2020 IoT Breakthrough Awards Program
SmartSens, the leading supplier of high-performance CMOS imaging systems, today announced that its SmartSens SC132GS product has been selected as the winner of the “IoT Semiconductor Solution of the Year” award in the 4th annual IoT Breakthrough Awards program from IoT Breakthrough, a leading market intelligence organization that recognizes the top companies, technologies and products in the global Internet-of-Things (IoT) market today. As 5G and AI-enabled applications accelerate toward industry-wide ‘intelligent’ system upgrades, SmartSens’ global shutter image sensor SC132GS is built specifically to power these applications.
