MISUMI, a global supplier of configurable components, is excited to announce the relocation of its North American corporate headquarters to Glenstar’s Schaumburg Corporate Center located at 1475 E. Woodfield Road. Located adjacent to Woodfield Mall, the total property is a 1 million-square-foot, three-building office complex. MISUMI plans to take occupancy in June 2020.
Water-Free Way to Make MXenes Could Mean New Uses for the Promising Nanomaterials
Ten years after producing the first sample of the now widely studied family of nanomaterials, called MXenes, Drexel University researchers have discovered a different way to make the atom-thin material that presents a number of new opportunities for using it. The new discovery removes water from the MXene-making process, which means the materials can be used in applications in which water is a contaminant or hampers performance, such as battery electrodes and next-generation solar cells.
Ranovus Announces a Strategic Collaboration with IBM, TE Connectivity and Senko Advanced Components
Ranovus Inc. (“RANOVUS”) today announced a strategic collaboration with IBM Inc. (“IBM”), TE Connectivity (“TE”) and Senko Advanced Components, Inc (“SENKO”), leading providers of multi-terabit interconnect solutions, to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry.
Keysight Validates Artificial Intelligence (AI) and Advanced Data Analytics Software in Nokia’s 5G Base Station Manufacturing Processes
Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, has validated an innovative new software approach, leveraging Artificial Intelligence (AI) and advanced data analytics, in Nokia’s 5G base station manufacturing processes, significantly improving test efficiency.
Renesas Electronics Unveils Industry’s Highest Performance Wideband mmWave Synthesizer
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a next-generation wideband mmWave synthesizer with the industry’s highest performance and unique set of features optimized for 5G and broadband wireless applications. The flagship 8V97003 device is ideal as a local oscillator (LO) for mmWave and beamforming, or a precision reference clock for a high-speed data converter in numerous applications such as test and measurements, optical networking, and data acquisition.
Olympus Supports FMC/TFM Training with OmniScan X3 Flaw Detectors
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, is delivering new OmniScan X3 phased array flaw detectors with FMC/TFM to the University of Ultrasonics to support their advanced training courses.
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Synopsys, Inc. (Nasdaq: SNPS) today announced the release of a major update to Simpleware™ ScanIP software, which extends its capabilities for segmenting anatomical regions through a new module, Simpleware AS Ortho (Auto Segmenter for Orthopedics). This new product offering is a machine learning (ML)-based auto segmentation module that builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.
Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
Advent of 5G and AI Chip Manufacturing Renews the Need for Advanced Semiconductor Testing Systems
A surge in semiconductor test volumes and stringent test demands from the communication, consumer electronics, automotive and healthcare verticals are expected to revive the semiconductor industry following a sharp decline in revenues for the global semiconductor automated test equipment market in 2019.
