A partnership that began in 2017 between Navajo Technical University (NTU) and the U.S. National Science Foundation Materials Research Science and Engineering Center at Harvard University is providing Navajo students with new opportunities to pursue advanced degrees in science and engineering while helping to address critical issues facing the Navajo Nation.
Advanced Chip Process Development Grows ALD/CVD Materials
TECHCET is forecasting the Semiconductor Precursor Materials Market to rebound by 15% in 2024, reaching $1.7 billion.
CEA-Leti Reports Three-Layer Integration Breakthrough On the Path for Offering AI-Embedded CMOS Image Sensor
CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor.
Applied Research Initiative Advances Arizona’s Semiconductor Ecosystem
Phoenix-based startup Crystal Sonic reimagines a key component of chip manufacturing by using sound-based technology.
eInfochips joins TSMC Design Center Alliance to Accelerate Semiconductor Innovation
eInfochips, an Arrow Electronics company, announced the company has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform® (OIP).
Lenovo and Cisco Announce Strategic Partnership to Simplify Path to AI Innovation
Lenovo and Cisco today unveiled a global strategic partnership to deliver fully integrated infrastructure and networking solutions designed to accelerate digital transformation for businesses of all sizes.
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development.
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
Nordson Corporation Announces Agreement to Acquire Atrion Corporation
Nordson Corporation today announced that it has entered into a definitive agreement to acquire Atrion Corporation.
Arrow Electronics and SiMa.ai Enter Distribution Agreement in EMEA
Global technology provider Arrow Electronics and SiMa.ai, the software centric, embedded edge machine learning system-on-chip company, have entered into a strategic collaboration, enabling Arrow to distribute SiMa.ai products in the EMEA region.
