Miniaturization of integrated circuits and microchips, elevated wafer production, and consistent growth of the semiconductors industry are anticipated to propel the adoption of EUV lithography into chip manufacturing across the globe. EUV lithography market is estimated for a staggering CAGR of 22% during the forecast period of 2019-2029.
Littelfuse Appoints Maria C. Green to Board of Directors
Littelfuse, Inc. (NASDAQ: LFUS), a global manufacturer of leading technologies in circuit protection, power control and sensing, announced today the appointment of Maria C. Green, retired Senior Vice President and General Counsel of Ingersoll-Rand plc (NYSE: IR), to the company’s board of directors, effective February 1, 2020.
Detection of Very High Frequency Magnetic Resonance Could Revolutionize Electronics
A team of physicists has discovered an electrical detection method for terahertz electromagnetic waves, which are extremely difficult to detect. The discovery could help miniaturize the detection equipment on microchips and enhance sensitivity. The researchers, led by physicist Jing Shi of the University of California, Riverside, generated a spin current, an important physical quantity in spintronics, in an antiferromagnet and were able to detect it electrically. To accomplish this feat, they used terahertz radiation to pump up magnetic resonance in chromia to facilitate its detection.
Rice Lab Turns Trash Into Valuable Graphene in a Flash
That banana peel, turned into graphene, can help facilitate a massive reduction of the environmental impact of concrete and other building materials. While you’re at it, toss in those plastic empties. A new process introduced by the Rice University lab of chemist James Tour can turn bulk quantities of just about any carbon source into valuable graphene flakes. The process is quick and cheap; Tour said the “flash graphene” technique can convert a ton of coal, food waste or plastic into graphene for a fraction of the cost used by other bulk graphene-producing methods.
SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies
The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, 3D roadmap and System-In-Package (SiP) technologies.
Nano-Thin Flexible Touchscreens Could Be Printed Like Newspaper
Researchers have developed an ultra-thin and ultra-flexible electronic material that could be printed and rolled out like newspaper, for the touchscreens of the future. The touch-responsive technology is 100 times thinner than existing touchscreen materials and so pliable it can be rolled up like a tube. To create the new conductive sheet, an RMIT University-led team used a thin film common in cell phone touchscreens and shrunk it from 3D to 2D, using liquid metal chemistry.
Researchers Expand Microchip Capability with New 3D Inductor Technology
Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of magnitudes more induction to meet the performance demands of modern electronic devices.
Lattice Diamond FPGA Development Tool Receives Key Industrial and Automotive Functional Safety Certifications
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that its easy to use Lattice Diamond FPGA design and verification software environment (version 3.10 Service Pack 3) is certified ascompliant with the IEC 61508 and ISO 26262 functional safety standards. These standards are widely used by developers in automotive and industrial applications, as OEMs require mission-critical systems used in their industrial control equipment and vehicles to deliver highly reliable performance with minimal system failures.
North American Semiconductor Equipment Industry Posts December 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.49 billion in billings worldwide in December 2019 (three-month average basis), according to the December Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 17.5 percent higher than the final November 2019 level of $2.12 billion, and is 17.8 percent higher than the December 2018 billings level of $2.11 billion.
Integrate Micro Chips for Electronic Skin
Researchers from Dresden and Osaka present the first fully integrated flexible electronics made of magnetic sensors and organic circuits which opens the path towards the development of electronic skin.
