ISE Labs, Inc., a provider of semiconductor engineering services, today announced it is broadening customer access to its world-class capabilities with the opening of a second U.S. facility, located in San Jose, Calif.
Compact and Scalable Multiple-Input Multiple-Output Systems for Future 5G Networks
A 28GHz time-division multiple-input multiple-output (MIMO) receiver with eight radio frequency elements, each occupying just 0.1 mm², has been developed by researchers at Tokyo Tech using 65nm CMOS technology.
Morse Micro Appoints Blake Hu as Vice President and Country Manager of Greater China and Southeast Asia
Morse Micro, a fabless semiconductor company and innovator in Wi-Fi HaLow technology, today announced the appointment of Blake Hu as the new Vice President and Country Manager of Greater China and Southeast Asia.
Mouser Electronics Awarded for Outstanding Performance from its Manufacturer Partners
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced that it has received 25 top business awards from its manufacturer partners for best-in-class performance during 2023, including over a dozen Distributor of the Year (DOY) Awards.
GCT Semiconductor and Kyocera Sign Development and Partnership Agreement
GCT Semiconductor Holding Inc. and Kyocera announce a collaboration to develop a 5G reference platform for customer premise equipment (CPE) and fixed wireless access (FWA) devices.
JEDEC Approaches Finalization of HBM4 Standard
JEDEC Solid State Technology Association today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
Accenture Acquires Cientra to Expand Silicon Design Capabilities
Accenture has acquired Cientra, a silicon design and engineering services company, offering custom silicon solutions for global clients. The terms of the acquisition were not disclosed.
AEM Introduces the New Generation of Automated Burn-In Systems for AI and High Performance Compute Chip Testing
AEM announced today the launch of a new burn-in capability for its high-parallel test platform, AMPS.
Fixstars Solutions to Showcase GPU-accelerated High-speed Networking Innovations at SEMICON West 2024
Fixstars Solutions is showcasing its latest innovations at Test Vision Symposium.
Technology Communications Trio Speed AI-Ready U.S. Workforce
MediaMobz, Hill + Kincaid PR and OuthinkAI announced today a strategic partnership to accelerate an AI-ready U.S. semiconductor workforce.
