Researchers have demonstrated the ability to engineer materials that are both stiff and capable of insulating against heat. This combination of properties is extremely unusual and holds promise for a range of applications, such as the development of new thermal insulation coatings for electronic devices.
VSORA and Partners CEA-Grenoble and Valeo Named Winners of France 2030 Embedded AI Call for Projects
VSORA, an innovative startup offering high-performance AI chips for Generative AI (GenAI) and autonomous driving, and partners CEA-Grenoble and Valeo were named winners of the Embedded AI Call for Projects, part of France 2030.
Himax Announces Strategic Investment in Obsidian Sensors
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its strategic investment in Obsidian Sensors, Inc., a San Diego-based thermal imaging sensor solution manufacturer.
Axus Technology Secures $12.5 Million in Capital Funding
Axus Technology, a provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing semiconductors and compound semiconductors, today announced it has received $12.5 million in capital funding from growth capital firm IntrinSiC Investment LLC.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
IEEE International Electron Devices Meeting (IEDM) Announces 2024 Call for Papers
Under the theme “Shaping Tomorrow’s Semiconductor Technology,” the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
EV Group Doubles Throughput of Semiconductor Layer Transfer Tech with EVG LayerRelease System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.
NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.
Biden-Harris Administration Announces CHIPS Act Funds for Absolics for Development of Glass Substrate Technology
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership.
