Shannon Davis

News and Web Editor

7096 Articles0 Comments

Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

EUV Materials Small But Strategic Fraction of $1.6B IC Photoresists Market

The global market for Photoresists and Ancillary Materials declined in 2019 due to semiconductor fabrication market challenges.

Transistor Count Trends Continue to Track with Moore’s Law

Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.

SkyWater Chosen by Applied Novel Devices (AND) to Produce New High-Performance Si Power MOSFETs

SkyWater Technology, the innovator’s trusted foundry partner, and Applied Novel Devices Inc, a designer, developer and supplier of novel semiconductor device technologies (“AND”), today announced the companies have entered into a licensing and manufacturing agreement to offer an improved standard process flow for Si power MOSFETs (metal oxide semiconductor field-effect transistors).

Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model

The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.

A Flexible Brain for AI

Researchers at Osaka Univ. fabricate an energy efficient reconfigurable computing engine that can be rewired to optimize its performance for artificial intelligence tasks. This work may lead to inexpensive and eco-friendly custom machine learning hardware.

Groovy Key to Nanotubes in 2D

Ultrathin carbon nanotubes crystals could have wonderous uses, like converting waste heat into electricity with near-perfect efficiency, and Rice University engineers have taken a big step toward that goal. The latest step continues a story that began in 2013, when Rice’s Junichiro Kono and his students discovered a breakthrough method for making carbon nanotubes line up in thin films on a filter membrane.

IKBFU Physicists Keep Improving ‘Smart’ Composites for Biomedical Sensors

IKBFU Physicists have successfully tested the new magnetic micro wire-based concept of “smart” composites production. The new composites are related to the multiferroic-class materials which have mutually controlled magnetic and electric properties. The effects observed in the compositions are considered to be a perspective platform for creating new devices from energy converters to highly sensitive sensors.

Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a Virtual Conference

Due to concerns over the global coronavirus (COVID-19) outbreak, the management committee and board of directors of the 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, has decided to hold IRPS 2020 as a virtual conference.

CyberOptics Launches 3D MX3000 Final Vision Inspection (FVI) System for Memory Modules

CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression (MRS)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.

Western Digital Announces Appointment of David Goeckeler as Chief Executive Officer

Western Digital Corp. (NASDAQ: WDC) today announced that David Goeckeler has been appointed chief executive officer and a member of the Western Digital Board of Directors (“the Board”), effective March 9, 2020. Mr. Goeckeler currently serves as executive vice president and general manager of Cisco’s $34 billion Networking and Security Business. Mr. Goeckeler succeeds Steve Milligan, who previously announced his intended retirement.