Optical sensing in the mid to long infrared (5microns – um) is becoming of utmost importance in different fields since it is proving to be an excellent tool for environmental monitoring, gas sensing, thermal imaging as well as food quality control or the pharmaceutical industry, to name a few. The amount of information hidden within this very rich spectral window opens new possibilities for multi or even hyperspectral imaging. Even though there are technologies that can address these challenges, they are very complex and expensive.
How Sensitive Can a Quantum Detector Be?
Quantum physics is moving out of the laboratory and into our everyday lives. Despite the big headline results about quantum computers solving problems impossible for classical computers, technical challenges are standing in the way of getting quantum physics into the real world. New research published in Nature Communications from teams at Aalto University and Lund University hopes to provide an important tool in this quest.
Synopsys’ John R. Rogers Named 2020 Recipient of the SPIE Rudolf and Hilda Kingslake Award
Synopsys, Inc. (Nasdaq: SNPS) today announced that Dr. John R. Rogers, principal engineer of imaging optics in the Optical Solutions Group at Synopsys, has been named the 2020 recipient of the SPIE Rudolf and Hilda Kingslake Award in Optical Design. SPIE, the international society for optics and photonics, presents the award in recognition of significant achievements in the field of optical design and optical engineering theory.
SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations
Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.
Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker
Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. “High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
Generation and Manipulation of Spin Currents for Advanced Electronic Devices
Graphene-based heterostructures of the van der Waals class could be used to design ultra-compact and low-energy electronic devices and magnetic memories. This is what a paper published in the latest issue of the Nature Materials journal suggests. The results have shown that it is possible to perform an efficient and tunable spin-charge conversion in these structures and, for the first time, even at room temperature.
CyberOptics Unveils WaferSense Auto Resistance Sensor (ARS) at SEMICON Korea
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Korea from February 5-7th, 2020 at the COEX in Seoul, booth #C236. During the show, the company will unveil and demonstrate its new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics.
Colloidal Quantum Dot Laser Diodes Are Just Around the Corner
Researchers reach a critical milestone on the path to versatile colloidal quantum dot laser diodes by successfully demonstrating a quantum dot LED that also operates as an optically pumped laser.
Silicon Mobility Names Rainer Kallenbach as CEO
Silicon Mobility, the technology player powering control solutions for a cleaner, safer, and smarter mobility, is pleased to announce the appointment of former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn
TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials.
