Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

On-Chip Light Source Produces Versatile Range of Wavelengths

Researchers have designed a new chip-integrated light source that can transform infrared wavelengths into visible wavelengths, which have been difficult to produce with technology based on silicon chips. This flexible approach to on-chip light generation is poised to enable highly miniaturized photonic instrumentation that is easy to manufacture and rugged enough to use outside the lab. In Optica, The Optical Society’s (OSA) journal for high impact research, investigators from the National Institute of Standards and Technology (NIST), University of Maryland, and University of Coloradodescribe their new optical parametric oscillator (OPO) light source and show that it can produce output light that is a very different color, or wavelength, than the input light. In addition to creating light at visible wavelengths, the OPO simultaneously generates near-infrared wavelengths that can be used for telecommunication applications.

XMC Introduces 50nm High-Performance Serial NOR Flash Memory

As a world leading provider of non-volatile memory, XMC, a core subsidiary of Unigroup, today announced the mass production status of new SPI NOR Flash series – XM25QWxxC, with the industry’s advanced 50nm Floating Gate NOR Flash manufacturing process, which features wide voltage range and low power consumption, offering excellent design flexibility for IoT, wearable and other power consumption sensitive applications.

ON Semiconductor to Demonstrate Intelligent IoT Technologies Including Advanced Audio Processing at CES 2020

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will showcase a wide range of innovative technologies for smart homes, connected buildings and personal IoT at CES 2020. The rise of voice control and Voice User Interfaces (VUI) has made audio processing critical to the success of a wide range of building automation and household applications. ON Semiconductor will feature two demonstrations using its LC823455, which provides key features for portable sound solutions and support for VUI. A Strata-enabled stereo speaker capable of streaming music over Bluetooth® will show various advanced audio functionalities including touch sensor-based volume control and voice commands. The LC823455 will also be featured in a cloud-based VUI demonstration for communication with IoT edge-nodes applications.

Boston Semi Equipment Extends Peak Voltage for Handling MOSFET, IGBT, Gate Arrays and SiC Power ICs

Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and an innovative provider of test automation technical services, announced today that it has enhanced its Zeus gravity feed handlers for MOSFET, IGBT, gate drivers, and SiC power ICs. A new test site design provides increased voltage isolation during testing, raising the peak voltage handled by the Zeus high voltage handler to 8.4kV RMS (11.8kV peak). The growing market for power ICs is driven by increasing demand for energy efficient products, such as electric vehicles. Automotive, medical, industrial and consumer markets will benefit from the efficiencies and lower cost of test by handling high voltage MOSFET, IGBT, gate drivers, and SiC devices in BSE’s Zeus handler.

Baidu and Samsung Electronics Ready for Production of Leading-Edge AI Chip for Early Next Year

Baidu, Inc. (NASDAQ: BIDU), a leading Chinese-language internet search provider, and Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year. Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

Blaize Presents Breakthrough AI Processing Architecture at CES 2020

Blaize™ today announced plans for the first public demonstrations of its Blaize Graph Streaming Processor™ (GSP™) architecture at CES 2020. A next-generation computing architecture designed for AI workloads, the Blaize offering tackles the economic and technical barriers to widespread AI adoption, addressing energy, cost and complexity challenges.

In Breakthrough Method of Creating Solar Material, NREL Scientists Prove the Impossible Really Isn’t

Scientists at the National Renewable Energy Laboratory (NREL) achieved a technological breakthrough for solar cells previously thought impossible. The scientists successfully integrated an aluminum source into their hydride vapor phase epitaxy (HVPE) reactor, then demonstrated the growth of the semiconductors aluminum indium phosphide (AlInP) and aluminum gallium indium phosphide (AlGaInP) for the first time by this technique.

Renesas Electronics Collaborates with Xilinx on Versal ACAP Reference Designs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its power solutions, as well as timing solutions from IDT, a wholly-owned subsidiary of Renesas, support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board. Built on 7nm process technology, Versal is the industry’s first ACAP platform that addresses the needs of a wide range of applications in data center, automotive, 5G wireless, and wired and defense markets.

Creating a Nanoscale On-Off Switch For Heat

Polymers are used to develop various materials, such as plastics, nylons, and rubbers. In their most basic form, they are made up of many of identical molecules joined together over and over, like a chain. If you engineer molecules to join together in specific ways, you can control the characteristics of the resulting polymer. Using this method, Sheng Shen, an associate professor of mechanical engineering at Carnegie Mellon University, and his research team created a polymer thermal regulator that can quickly transform from a conductor to an insulator, and back again. When it’s a conductor, heat transfers quickly. When it’s an insulator, heat transfer much more slowly. By switching between the two states, the thermal regulator can control its own temperature, as well as the temperature of its surroundings, such as a refrigerator or computer.

Compound Photonics Announces World’s Smallest 2Kx2K Microdisplay for Wide Field of View AR/MR Applications

Compound Photonics U.S. Corporation (CP), the leader in compact high-performance microdisplay solutions, today announced the release of its CP2K234 series of Liquid Crystal on Silicon microdisplays targeting next generation AR/MR (Augmented/Mixed Reality) smart glasses, head-mounted display (HMD) and heads-up display (HUD) applications. With its industry leading small 3.015 μm pixel, native 2048×2048 resolution and a unique 1:1 aspect ratio, this 0.34” diagonal display enables retina resolution (60 pixels/degree) when combined with next generation 50°+ wide field-of-view waveguides. The CP2K234 is available as either a polarization (amplitude) or phase (holographic) modulator.