Leaders in memory IC and foundry production maintain strongest capacity presence.
Veteran Technologist Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group
SEMI today announced the appointment of Timothy Brosnihan as Executive Director of the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. A skilled electronics industry executive and seasoned technologist, Brosnihan brings to MSIG extensive MEMS and sensors, product development and manufacturing experience. In his new role, he will direct MSIG global activities including its research and development, standards, and technical programs. Brosnihan will also spearhead MSIG executive conferences and develop new services for the MEMS and sensors industry.
SEMI Industry Strategy Symposium Europe to Explore Tech’s Role in Meeting Region’s Most Pressing Needs
“ISS Europe is a powerful forum for identifying collaboration opportunities to strengthen Europe’s competitive advantage in the digital economy,” said Laith Altimime, president of SEMI Europe. “With the emergence of 5G, artificial intelligence (AI), augmented reality/virtual reality (AR/VR), quantum computing and other leading-edge technologies, the semiconductor industry is well-positioned to help drive the digital transformation for Europe’s societal and economic prosperity.”
Powering the Future: Smallest All-Digital Circuit Opens Doors to 5nm Next-Gen Semiconductor
Scientists at Tokyo Institute of Technology (Tokyo Tech) and Socionext Inc. have designed the world’s smallest all-digital phase-locked loop (PLL). PLLs are critical clocking circuits in virtually all digital applications, and reducing their size and improving their performance is a necessary step to enabling the development of next-generation technologies.
Wearable Medical Sensors Will Get Major Sensitivity Boost
Biosensors integrated into smartphones, smart watches, and other gadgets are about to become a reality. In a paper featured on the cover of the January issue of Sensors, researchers from the Moscow Institute of Physics and Technology describe a way to increase the sensitivity of biological detectors to the point where they can be used in mobile and wearable devices. The study was supported by the Russian Science Foundation.
Moving Precision Communication, Metrology, Quantum Applications From Lab to Chip
The field of photonic integration — the area of photonics in which waveguides and devices are fabricated as an integrated system onto a flat wafer — is relatively young compared to electronics.
Palomar Technologies Moves to New Global Headquarters, Expands Manufacturing Footprint to Meet Growth Goals and Customer Needs
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging announced that to meet growing customer demand for its solutions around the world, it has moved to a new global headquarters and expanded its facilities to over 110,000 square feet.
Eta Compute Announces Production Silicon of the World’s Most Energy-efficient Edge AI Processor
Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices using its revolutionary new platform, announces the first shipment of production silicon for its ECM3532, the world’s first AI multicore processor for embedded sensor applications. This unique multicore device features the company’s patented Continuous Voltage Frequency Scaling (CVFS) and delivers power consumption of microwatts for many sensing applications.
BrainChip Akida Development Environment Now Freely Available to System Developers
BrainChip Holdings Ltd. (ASX: BRN), a leading provider of ultra-low power, high-performance edge AI technology, today announced that access to its Akida™ Development Environment (ADE) no longer requires pre-approval, now allowing designers to freely develop systems for edge and enterprise products on the company’s Akida Neural Processing technology.
Quik-Pak Announces Substrate Development Service
Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly service. Utilizing virtually any substrate type, Quik-Pak can create turnkey solutions for substrate-based assemblies to accommodate customers’ unique packaging requirements, with delivery times at least 50 percent faster than those of competitive services.
