SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU with China-based Atron Technologies, on May 23, 2024.
How a Tiny Device Could Lead to Big Physics Discoveries and Better Lasers
Rensselaer Polytechnic Institute researchers have created the first topological quantum simulator device in the strong light-matter interaction regime that operates at room temperature.
SIA Applauds CHIPS Act Incentives for Absolics Project in Georgia
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Absolics, an affiliate of the Korea-based SKC.
SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs
RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
The Dominican Republic and Purdue University Sign MOU to Drive Semiconductor Growth
The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country’s semiconductor industry and national development.
NHanced Semiconductors Launches New Website
Redesigned website showcases the company’s innovative Foundry 2.0 manufacturing model, with intuitive navigation and more news and blog options.
Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
Toshiba Completes New 300mm Wafer Fabrication Facility for Power Semiconductors
Toshiba Electronic Devices & Storage Corporation today held a ceremony to mark the completion of a new 300mm wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan.
ROHM Semiconductor and Nanjing SemiDrive Technology Jointly Develop a Reference Design
ROHM Semiconductor and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, today announced they have jointly developed a smart cockpit reference design.
