SEMICON Japan 2019, the largest and most influential gathering of the electronics manufacturing supply chain in Japan with nearly 55,000 attendees expected, opens tomorrow at Tokyo Big Sight to focus on growth opportunities in smart transportation and smart manufacturing and the critical importance of business continuity planning (BCP). Industry leaders and visionaries from across the electronics supply chain will gather December 11-13 at SEMICON Japan 2019 – themed Enabling a Smarter World – for insights into the latest technologies, innovations and trends in the electronics industry.
Breker Verification Systems Launches Unique RISC-V TrekApp for Automated, High-Coverage System Integration Test Suite Synthesis
Breker Verification Systems, the provider of Test Suite Synthesis tools based on the Portable Stimulus Standard (PSS), today introduced its RISC-V TrekApp, a complete, automated test content generator for RISC-V system integration testing. RISC-V TrekApp, the first solution to address the entire RISC-V system-on-chip (SoC) system integration problem, targets complex verification challenges and increases coverage by executing unpredictable corner-case scenarios without the need for manually developed test content. The TrekApp works with existing universal verification methodology (UVM) and SoC verification environments and does not require the user to learn the PSS language.
Imec Presents Forksheet Device as The Ultimate Solution to Push Scaling Towards the 2nm Technology Node
This week, at the 2019 IEEE International Electron Devices Meeting, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents first standard cell simulation results of its forksheet device designed for sub-3nm logic technology nodes. Compared to nanosheet devices, the reduced n-to-p spacing results in a 10 percent performance increase. When combined with scaling boosters, the new device architecture will bring logic standard cell height down to 4.3 tracks, which combined with cell template optimization can result in more than 20 percent area reduction. The results value the forksheet architecture as a potential solution to extend the scalability of nanosheet structures beyond the 3nm logic technology node.
NSITEXE Selects SmartDV TileLink Verification IP for RISC-V Based Applications
SmartDV™ Technologies today announced NSITEXE licensed its TileLink VIP to ensure complete verification of its high-efficiency and high-quality semiconductor IP adaptable to various applications using the RISC-V architecture. NSITEXE selected SmartDV because it is the only VIP solutions provider to offer a smart way to verify the TileLink fabric and reduce verification time. SmartDV’s VIP verifies the TileLink chip-scale interconnect standard, an open-source, high-performance and scalable cache-coherent fabric for RISC-V based or alternative architecture system-on-chip (SoC) designs.
Imec Shows Excellent Performance in Ultra-Scaled FETs with 2D-Material Channel
At this year’s IEEE International Electron Devices Meeting (Dec 7-11 2019), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, reports an in-depth study of scaled transistors with MoS2 and demonstrates best device performance to date for such materials.
Creating Switchable Plasmons in Plastics
Researchers in the Organic Photonics and Nano-optics goup at the Laboratory of Organic Electronics have developed optical nanoantennas made from a conducting polymer. The antennas can be switched on and off, and will make possible a completely new type of controllable nano-optical components.
memsstar Ships MEMS Production System to University of Freiburg in Support of the PROMYS Project
memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and microelectrical mechanical systems (MEMS), announced today shipment of its three-chamber ORBIS™ 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) at the University of Freiburg, Germany. As part of the nationally funded project, “Processes and Materials for More-than-Moore Electronic Systems (PROMYS),” memsstar’s surface micromachining cluster tool will serve as a central unit for the micromechanical structuring of MEMS components for up to 200mm wafers.
Intel Introduces ‘Horse Ridge” to Enable Commercially Viable Quantum Computers
Intel Labs today unveiled what is believed to be a first-of-its-kind cryogenic control chip — code-named “Horse Ridge” — that will speed up development of full-stack quantum computing systems.
SiFive Retains Title of Most Respected Private Semiconductor Company
SiFive, the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it has been recognized for the second consecutive year as the Most Respected Private Semiconductor Company by the Global Semiconductor Alliance (GSA) at the GSA Awards Dinner on Dec. 5, 2019. This recognition tops a milestone year for the company, which announced more than 130 design wins, completed Series D investments to secure over $100M total funding to date and continued to attract the industry’s top talent.
Analog Devices Files Patent Infringement Lawsuit Against Xilinx
Analog Devices, Inc. (Nasdaq: ADI), a leading global high-performance analog technology company, today announced that it has filed a patent infringement lawsuit against Xilinx, Inc. (Nasdaq: XLNX). The lawsuit focuses on the unauthorized use by Xilinx of several important ADI patents relating to converter technology in at least two of Xilinx’s High End Zynq UltraScale+ RFSoC products.
