A research collaboration between Rice University and the Energy Safety Research Institute (ESRI) at Swansea University has found that old newspapers can be used as a low cost, eco-friendly material on which to grow single walled carbon nanotubes on a large scale. The new study, published in the MDPI Journal C , details the research experiments carried out in producing carbon nanotubes which could have the potential to solve some of the problems associated with their large scale production.
Carbon Nanotube Technology Exceeds 100GHz for First Time in RF Applications
Carbonics, Inc. today announced that carbon nanotube technology has for the first time achieved speeds exceeding 100GHz in-radio frequency (RF) applications. The milestone eclipses the performance – and efficiency – of traditional RF-CMOS technology that is ubiquitous in modern consumer electronics including cell phones. The news opens the door for this new technology to potentially provide a powerful boost for 5G and mm-Wave technologies. The milestone was reported in the paper, “Wafer-scalable, aligned carbon nanotube transistors operating at frequencies of over 100 GHz,” published this week in the journal, Nature Electronics. A separate commentary in Nature Electronics called the research “a remarkable technology milestone.”
A Super-Fast ‘Light Switch’ for Future Cars and Computers
Self-driving cars have become better and more reliable in recent years. Before they might be allowed to drive completely autonomously on our roads in the near future, however, a few hurdles have to be taken. Above all, the need to assess the surroundings at lightning speed and to recognize people and obstacles takes current technologies to its limits. A team of scientists led by Juerg Leuthold at the Institute for Electromagnetic Fields at ETH Zurich, together with colleagues at the National Institute of Standards and Technology (NIST) in the USA and at Chalmers University in Gothenburg (Sweden), has now developed a novel electro-opto-mechanical switch that might be able to elegantly solve both problems in the future.
Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics Let Small Devices Handle Bigger User Data
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new generation of memory chips that combine unprecedented storage density with speed and reliability, enabling the devices we use every day to do more to enrich life and work. With 4Mbit capacity, ST’s new EEPROM memories let small devices capture and store more data through the serial SPI bus. This enables equipment such as smart meters to intensify data logging for managing grids more effectively and providing more user-friendly billing. Also, portable medical devices can log patients’ data more intensively to improve care quality, and consumer devices such as smart wearables can support more user features and greater precision. In these applications, the memory’s low power consumption helps extend battery runtime. A wide range of applications in industrial controls and communication infrastructure such as network switches can also benefit from these higher density memories.
SET, Smart Equipment Technology, Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production
SET, Smart Equipment Technology, the leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonderdesigned for± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM).NEO HB is suitable for direct hybrid bonding processes.
DesignCon Expands Into Artificial Intelligence, Automotive, 5G, IoT, and More For 2020 Edition
DesignCon, the nation’s largest event for chip, board, and systems design engineers, today announced new areas of focus for the 2020 edition highlighting advances in the fields of 5G, artificial intelligence (AI), automotive, and IoT, producing the most in-demand electronics emerging today. Topics will be examined through a 14-track conference schedule spanning technical sessions, boot camps, tutorials, and more to fit the needs of the hardware design engineering community. DesignCon returns to Silicon Valley for its 25th year, taking place from January 28-30, 2020 at the Santa Clara Convention Center.
Presto Adds New Executives to the Leadership Team
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces the hire of two new executives: Sophie Vaucher, vice president Finance, and Alexandra Moulin, vice president Human Resources. Sophie Vaucher brings ten years of experience in corporate finance and strategy in international industrial companies. Most recently, she held a global finance business partner role at Sibelco where she served in various senior positions for eight years. She was positioned in Asia for four years, where she integrated a new acquisition in the group and set up local teams.
ETEL’s Newly Optimized IL+ Motors For Electronics & Semiconductor Manufacturing
ETEL, a direct drive motor manufacturer of the HEIDENHAIN Group, now offers updated ironless linear motors optimized for electronics and semiconductor manufacturing. Called the IL+ product lines, these motors are offered in the same profile as ETEL’s previously established ironless linear motors but now specially re-designed to allow for increased performance to benefit these two industries. Unique to the IL+, a change in material selection now allows the ETEL ironless motors to operate up to 600VDC and reach a temperature limit up to 130°C, as opposed to the previous market standard of 300VDC and 80°C. This allows an increase in overall speed along with a greater force operating range. Track sizes are available in increments of 128, 256, and 512mm.
Industry’s Only Worldwide OSAT Manufacturing Sites Database Now Tracks 360 Facilities, Expands Test Site Coverage
SEMI and TechSearch International today announced a new edition of the Worldwide OSAT Manufacturing Sites Database – the only outsourced semiconductor assembly and testing (OSAT) supplier database available in the market. The report, an essential business tool for anyone interested in device packaging, tracks facilities that provide packaging and testing services to the semiconductor industry. The new edition includes more than 80 updates spanning packaging technology offerings, product specialization and ownership/shareholder updates. Adding more than 30 new test facility additions to bring the total number of facilities tracked to 360, the database helps semiconductor manufacturers identify service offerings around the globe, an increasingly important task in supply chain management.
Accenture, Airbus, GE and Hitachi Join Intel Neuromorphic Research Community
Today, Intel announced the first corporate members — Accenture, Airbus, GE and Hitachi — to the fast-growing Intel Neuromorphic Research Community (INRC). The INRC has tripled in size over the past year and now has more than 75 organizations, spanning leading universities around the world, government labs, neuromorphic start-up companies, and now several Fortune Global 500 members.
