MoDeCH Inc., a company founded in 2002 and dedicated to delivering modeling services to PCB and semiconductor designers, today launched its English language ecommerce site, “Model On! Search.” Previously available only in Japan, Model On! was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets.
USMCA Approval Strengthens U.S. Technology and Trade Leadership
The Semiconductor Industry Association (SIA) today applauded Senate approval of the U.S.-Mexico-Canada Agreement (USMCA), which passed with strong bipartisan support earlier today. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor company sales. “Congressional approval of the USMCA is a major win for free trade and America’s global leadership in semiconductors and the technologies they enable,” said John Neuffer, SIA president and CEO. “The agreement will help ensure that more products researched, designed, and made in America – including semiconductors – can flow to customers around the world. We applaud the Administration and Congress for negotiating and approving this landmark agreement.”
Synopsys Joins New Autonomous Vehicle Computing Consortium
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has joined the new Autonomous Vehicle Computing Consortium. The Consortium brings together leading experts in the automotive, automotive supply, semiconductor and computing industries to help accelerate the delivery of safer and affordable vehicles. As a member of the Consortium, Synopsys will actively contribute to the development of a set of recommendations for system architectures and computing platforms that will be used to address the challenges of deploying self-driving vehicles at scale.
Worldwide Semiconductor Revenue Declined 11.9% in 2019
Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018, according to preliminary results by Gartner, Inc. Intel regained the No. 1 position in the market as the downturn in the memory market negatively impacted many of the top vendors, including Samsung Electronics, the No. 1 vendor by revenue in 2018 and 2017. Intel reclaimed its position as the No. 1 global semiconductor vendor by revenue in 2019, recovering the position from Samsung Electronics, which held it for the past two years. Intel’s semiconductor revenue declined 0.7% in 2019, driven by a slowdown in the server market, an ongoing constrained CPU supply and the 4Q19 sale of its cellular modem business to Apple.
Colloidal Quantum Dot Photodetectors Can Now See Further Than Before
Optical sensing in the mid to long infrared (5microns – um) is becoming of utmost importance in different fields since it is proving to be an excellent tool for environmental monitoring, gas sensing, thermal imaging as well as food quality control or the pharmaceutical industry, to name a few. The amount of information hidden within this very rich spectral window opens new possibilities for multi or even hyperspectral imaging. Even though there are technologies that can address these challenges, they are very complex and expensive.
How Sensitive Can a Quantum Detector Be?
Quantum physics is moving out of the laboratory and into our everyday lives. Despite the big headline results about quantum computers solving problems impossible for classical computers, technical challenges are standing in the way of getting quantum physics into the real world. New research published in Nature Communications from teams at Aalto University and Lund University hopes to provide an important tool in this quest.
Synopsys’ John R. Rogers Named 2020 Recipient of the SPIE Rudolf and Hilda Kingslake Award
Synopsys, Inc. (Nasdaq: SNPS) today announced that Dr. John R. Rogers, principal engineer of imaging optics in the Optical Solutions Group at Synopsys, has been named the 2020 recipient of the SPIE Rudolf and Hilda Kingslake Award in Optical Design. SPIE, the international society for optics and photonics, presents the award in recognition of significant achievements in the field of optical design and optical engineering theory.
SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations
Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.
Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker
Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. “High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
Generation and Manipulation of Spin Currents for Advanced Electronic Devices
Graphene-based heterostructures of the van der Waals class could be used to design ultra-compact and low-energy electronic devices and magnetic memories. This is what a paper published in the latest issue of the Nature Materials journal suggests. The results have shown that it is possible to perform an efficient and tunable spin-charge conversion in these structures and, for the first time, even at room temperature.
