The upcoming 65th annual IEEE International Electron Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square hotel, will once again feature the latest and most important research taking place in semiconductors and other electron devices, but with a sharper focus this year on devices intended to support diverse new applications.
Arm TechCon 2019: Showcasing the New Era of Total Compute
Now in its 15th year, Arm® TechCon 2019, will explore three emergent technologies, AI, 5G, and a secure IoT, all of which are converging to enable more meaningful data insights and fuel a shift into the New Era of Total Compute.
3D Optical Sensing Ready for Prime Time
The 3D optical sensing market is once again surging – and it’s all thanks to Apple. What will we see in the next wave of end products enhanced by this technology, how will other market segments approach – and eventually use – 3D optical sensing, and which suppliers stand to gain the most from this very vital technology?
SIA Statement Following Commerce’s Announcement to Extend the Temporary General License
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA President & CEO John Neuffer following the Department of Commerce announcement adding Huawei affiliates to the entities list and providing an extension of the Temporary General License until November 2019.
Lab-On-A-Chip Drives Search For New Drugs to Prevent Blood Clots
Microfluidic tech effectively shrinks a medical pathology laboratory onto a small chip.
Creating Customer Value: A Case Study on 300mm Manufacturing Learning for Back Qualification of 200mm Processing
The cost of many 300mm chemical Mechanical Planarization (CMP) consumables has decreased in recent years due to a maturing market and new process learning, making it economically feasible to embark on a new 200mm Oxide CMP polishing process based on these advanced commercial consumables in the market, today.
Cerebras Systems Unveils the Industry’s First Trillion Transistor Chip
Cerebras Systems, a startup dedicated to accelerating Artificial intelligence (AI) compute, today unveiled the largest chip ever built. Optimized for AI work, the Cerebras Wafer Scale Engine (WSE) is a single chip that contains more than 1.2 trillion transistors and is 46,225 square millimeters.
Stanford Builds a Heat Shield Just 10 Atoms Thick to Protect Electronic Devices
Atomically thin heat shields could be up to 50,000 times thinner than current insulating materials in cell phones and laptops.
Researchers Demonstrate Three-Dimensional Quantum Hall Effect For the First Time
The three-dimensional quantum Hall effect was predicted more than 30 years ago, but has not been observed until now by the Singapore University of Technology and Design together with international researchers.
SEMI Unveils Technology Showcase Finalists for MEMS & Imaging Sensors Summit
SEMI Europe today announced finalists for the Technology Showcase for MEMS & Sensors and the Technology Showcase for Imaging Sensors at SEMI MEMS & Imaging Sensors Summit, 25-27 September, 2019 in Grenoble, France.
