An international team of scientists led by researchers from the Laboratory of Nanomaterials at the Skoltech Center for Photonics and Quantum Materials (CPQM) have rationally designed a novel p-type flexible transparent conductor using single-walled carbon nanotubes. This opens new avenues for its applications in next generation opto-electronics and energy technologies. The results of the study were published in the prestigious international journal Nano Energy. Most of the optical and electronic devices encountered daily are constituted of transparent conductors. However, all the presently available transparent conductors are n-type semiconductors, thus restricting technological advancement. The emergence of carbon nanotubes as p-type transparent conductors has been promising. Its further development will be tremendously instrumental for various opto-electronics and energy technologies.
EV Group and Delo Partner to Expand Materials and Process Capability for Wafer-Level Optics and Nanoimprint Lithography
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is partnering with DELO, a leading manufacturer of industrial high-tech adhesives, in the area of wafer-level optics (WLO). Both companies, well-known for their leading roles in optical sensor manufacturing, are combining efforts to enable novel optical devices and applications, such as biometric authentication and facial recognition, for the industrial, automotive and consumer electronics markets utilizing EVG’s leading lens molding and nanoimprint lithography (NIL) process equipment and DELO’s advanced adhesives and resist materials.
Presto Engineering Achieves EAL6 Certification for Secure Product Provisioning
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, has achieved EAL6 (Evaluation Assurance Level 6) — an assurance and independent verification of very high levels of security to protect valuable data. Secured applications initiated with the smart card industry and now permeate most industrial applications, as well as automotive and IoT. EAL, which ranges from 1-7 (a higher level means that the evaluation completed a more stringent set of quality assurance requirements), is a critical aspect to consider when selecting an outsourced manufacturing partner for secure applications.
Heilind Electronics Adds American Sensor Technologies (AST) to TE Connectivity Portfolio
Heilind Electronics, a premier distributor of electronic components worldwide, has partnered with TE Connectivity (TE) to bring its customers an extensive range of harsh environment pressure and liquid level sensors. The new products are part of TE’s American Sensor Technologies (AST) brand, which complements the distributor’s existing TE Measurement Specialties solutions. A key part of Heilind’s new AST offering is hazardous location pressure transducers. These items are certified to CSA, UL, ATEX and other standards that qualify them as explosion proof, intrinsically safe or non-incendive. In addition, customers can request customized designs and configure options like process connections, materials, pressure ranges and output.
Blaize Emerges from Stealth to Transform AI Computing
Blaizeä today emerged from stealth and unveiled a groundbreaking next-generation computing architecture that precisely meets the demands and complexity of new computational workloads found in artificial intelligence (AI) applications. Driven by advances in energy efficiency, flexibility, and usability, Blaize products enable a range of existing and new AI use cases in the automotive, smart vision, and enterprise computing segments, where the company is engaged with early access customers. These AI systems markets are projected to grow rapidly* as the disrupting influence of AI transforms entire industries and AI functionality becomes a “must-have” requirement for new products.
Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications.
Stretchable, Degradable Semiconductors
To seamlessly integrate electronics with the natural world, materials are needed that are both stretchable and degradable — for example, flexible medical devices that conform to the surfaces of internal organs, but that dissolve and disappear when no longer needed. However, introducing these properties to electronics has been challenging. Now, researchers reporting in ACS Central Science have developed stretchable, degradable semiconductors that could someday find applications in health and environmental monitoring.
SEMICON Europa Opens with SMART Mobility, MedTech, Design and Talent in Spotlight
SEMICON Europa, Europe’s largest event connecting the entire electronics design and manufacturing supply chain – from innovation to applications – opens today in strategic co-location with productronica at Messe München, in Munich, Germany. Themed Semiconductors Drive Smart, SEMICON Europa 2019 – Nov. 12-15 – highlights the vital importance of European sectors and ecosystems in propelling the semiconductor manufacturing industry and the broader electronics design and manufacturing supply chain worldwide.
Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter
Marking the fourth consecutive quarterly decline, worldwide silicon wafer area shipments totaled 2,932 million square inches in the third quarter of 2019, down 1.7 percent from the 2,983 million square inches shipped in the second quarter of the year and 9.9 percent lower than shipments during the same period in 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys
NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC. UWB provides precise, secure, real-time localization capabilities unrivaled by other wireless technologies such as Wi-Fi, Bluetooth, and GPS. The technology is designed to give spatial awareness to UWB-equipped cars, mobiles, and other smart devices, to enable cars to know exactly where the users are. For the first time, smartphone-based car access offers the same level of convenience as state-of-the-art key fobs. Users can open and start cars, while leaving their phones in their pockets or bags, and enjoy secure remote parking via smartphone.
