New facility equipped with cleanrooms and latest eutectic die attach systems.
Greener, Faster and Cheaper Way to Make Patterned Metals for Solar Cells and Electronics
An innovative way to pattern metals has been discovered by scientists in the Department of Chemistry at the University of Warwick, which could make the next generation of solar panels more sustainable and cheaper.
The First Metal-Organic Coordination Polymers Were Synthesized at the Samara Polytech
The resulting nanostructured materials have unique properties.
Edwards Vacuum Opens North American Semiconductor HQ in Hillsboro
Innovation and manufacturing center will employ 250+ workers, including 100 new jobs.
Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement
Toppan Photomasks, Inc. and GLOBALFOUNDRIES today announced that they have entered into a multi-year supply agreement in which Toppan will provide GF with photomasks and related services currently supported by GF’s Burlington, Vermont U.S. photomask manufacturing operation.
Smart Tech, Innovation, Industry Future in Spotlight at SEMICON Taiwan 2019
Spanning the entire semiconductor and microelectronics supply chain – from design through systems – SEMICON Taiwan 2019 will gather the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data.
Innovative Foundry Technologies Commences Patent Litigation Against UMC
Innovative Foundry Technologies LLC (IFT US) announced that its Dutch subsidiary, Innovative Foundry Technologies B.V. (IFT BV) has initiated patent litigation in Germany against Taiwan-based semiconductor foundry, United Microelectronics Corporation (UMC), for infringement of one of IFT BV’s semiconductor fabrication patents.
Flash Memory Summit Announces 2019 SuperWomen in Flash Leadership Award
Flash Memory Summit (FMS) and the Evaluator Group announced Calline K. Sanchez winner of the SuperWomen in Flash Leadership Award.
MRAM, A Promise Beyond eFlash
Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for eFlash. This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded NVM for code/data storage is needed.
Sharp Meets Flat in Tunable 2D Material
A Rice University lab wants its products to look sharp, even at the nanoscale. Its latest creation is right on target.
