Altair has been selected as an electronic design automation (EDA) partner for the Samsung Advanced Foundry Ecosystem (SAFE).
Global Total Semiconductor Equipment Sales Forecast to Reach Record $109 Billion in 2024, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4% year-on-year, SEMI announced today at SEMICON West 2024.
Advent Diamond Unveils ClearXCam 2304: Redefining X-ray Beam Monitoring
Advent Diamond, a company focused on developing diamond semiconductor technology, announces the release of ClearXCam 2304, a significant advancement in X- ray beam monitoring.
Critical Materials Council Celebrates 30 Years
TECHCET celebrates the 30th year anniversary of the Critical Materials Council (CMC).
SEMI and Semiconductor Digest Announce 2024 Best of West Award Finalists
The Best of West Award winner will be announced at SEMICON West 2024 on Thursday, July 11 at 11:00 a.m. PDT in the Media Hub.
Global Semiconductor Sales Increase 19.3% Year-to-Year in May
May sales increase on a year-to-year basis by largest percentage since April 2022; worldwide chip sales increase 4.1% month-to-month.
Flexible Nanoimprint Lithography Enables Efficient Fabrication of Biomimetic Microstructures
Gallium nitride (GaN)-based light-emitting diodes (LEDs) have transformed the lighting industry by replacing conventional lighting technologies with superior energy efficiency, longer operating life and greater environmental sustainability.
Axus Technology Receives Orders for Capstone CMP System from World’s Top SiC Device Makers
Axus Technology, a global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced strong sales momentum for its innovative Capstone CS200 Series – the industry’s latest CMP processing tool.
Applied Materials Unveils Chip Wiring Innovations for More Energy-Efficient Computing
Applied Materials Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond.
JST Wins New Order for 300mm Ospray Multi-Chamber Single-Wafer Wet Processing System
Highly flexible platform delivers unprecedented flexibility, precision, and repeatability during the etching and deposition process.
