The rapid development of artificial intelligence in the past decade has greatly enhanced the ability of wearable devices to process complex data.
New Nano-Device Could Mean Your Run Could Power Your Electrical Wearables
Your early morning run could soon help harvest enough electricity to power your wearable devices, thanks to new nanotechnology developed at the University of Surrey.
Oxford Instruments Asylum Research Receives R&D 100 and Frost & Sullivan Awards for its Vero Atomic Force Microscope
Oxford Instruments Asylum Research announced today that its next-generation Atomic Force Microscope (AFM), Vero, has received three prestigious awards.
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
The Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED
Fujitsu Semiconductor Memory Solution Limited is pleased to announce that the company name will change to RAMXEED LIMITED, effective January 1, 2025.
Lambda Announces Strategic Partnership with SK Telecom to Expand Cloud Services in South Korea
Lambda, the AI developer cloud, today announced a partnership with South Korea’s largest mobile telecommunications company, SK Telecom (SKT).
Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5×6 Package
Alpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new highly robust power MOSFET LFPAK 5×6 package.
Pfeiffer Vacuum Achieves Gold Medal in EcoVadis Sustainability Ranking
Pfeiffer Vacuum, a member of the global Busch Group, has once again been awarded the prestigious EcoVadis Gold Medal for its site in Asslar.
TSMC Breaks Ground, Secures Subsidy for German Plant
The Taiwan Semiconductor Manufacturing Company (TSMC) has begun work on a 10-billion-euro plant in Dresden as the European Union approves state assistance for the project.
