Today at the Linley Fall Processor Conference in Santa Clara, Calif., Intel revealed the first architectural details related to Tremont. Intel’s newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations.
Semiconductor Acquisitions Regain Momentum in 2019
After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019 with the combined value of about 20 M&A agreement announcements reaching $28.0 billion for the purchase of chip companies, business units, product lines, intellectual property (IP), and wafer fabs between January and the end of August.
ASE Group Significantly Advances Semiconductor Packaging Development With ANSYS Customization Toolkit Solution
ASE Group (ASE) engineers have drastically improved their integrated circuit (IC) semiconductor packaging and development process to create state-of-the-art microchips thanks to ANSYS (NASDAQ: ANSS). Developing an ANSYS Customization Toolkit (ACT) solution, engineers create more accurate models, enhance structural reliability and slash design time to enable customers to receive products faster than ever.
Award-winning Lattice sensAI Solutions Stack Further Extends Lead in Ultra Low-power AI at the Edge
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of performance enhancements and new and improved application reference designs for its award-winning sensAI™ solutions stack. sensAI helps OEMs develop AI and ML experiences for next-generation smart devices with power consumption measured in milliwatts.
New Architected Material Shape-Changes to Tune Its Qualities
Architected materials are comprised of micron and nanoscale structures like crossbeams, arches, domes, and spirals, much like the elements of a building’s architecture. Researchers from the California Institute of Technology, the Georgia Institute of Technology, and ETH Zurich have made an architected material that shifts the shapes of these structures. When a slight current is applied, nanoscale beams thicken and bend into arches that increasingly bow as the current is boosted. The material maintains the new shape even when the current is off, and the shape can be changed back by reversing the current. Both are novel characteristics.
North American Semiconductor Equipment Industry Posts September 2019 Billings
North America-based manufacturers of semiconductor equipment posted $1.95 billion in billings worldwide in September 2019 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.4 percent lower than the final August 2019 level of $2.00 billion, and is 6.0 percent lower than the September 2018 billings level of $2.08 billion. “Monthly billings of North American equipment manufacturers declined for the second consecutive month,” said Ajit Manocha, president and CEO of SEMI.
Seoul Semiconductor Obtains Permanent Injunction Against Philips TV Product
Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that it has successfully obtained a judgement of permanent injunction in a patent infringement lawsuit against Fry’s Electronics, one of the largest big-box retailer of consumer electronics in the United States. The Texas Eastern District federal court issued a permanent injunction against the sales of several TV and lighting products, including a Philips TV product, as well as light bulbs of Feit Electric, according to a stipulation made between Seoul and Fry’s.
FEFU and FEB RAS Scientists Are Close to Integrating Silicon Electronics and Spintronics
Scientists from Far Eastern Federal University (FEFU) and the Far Eastern Branch of the Russian Academy of Sciences (FEB RAS) developed the nanoheterostructure consisted of a nanocrystal magnetite film (Fe3O4) covering a silicon substrate with an additional layer of silicon oxide (SiO2/Si). Its magnetic and magnetotransport properties may help to design highly efficient hybrid semiconductor devices with new spintronic elements. The related article was published in the Journal of Alloys and Compounds.
ESD Alliance Takes SMART Design to SEMICON Europa
The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, today unveiled SMART Design, the first system-centric series showcasing advances in electronic system design to be held at SEMICON Europa. SEMICON Europa will begin Tuesday, November 12, through Friday, November 15, at Messe München in Munich, Germany. SMART Design is scheduled for Wednesday, November 13, from 2:30 p.m. until 5 p.m. in TechARENA 1, Hall B1.
New Operational Technology Cyber Security Alliance Launches to Deliver Comprehensive Cyber Security Guidelines for Operational Technology
Cyber-attacks on critical and industrial infrastructure are on the rise, impacting operational reliability and business risk across all industries, including utilities, manufacturing and oil & gas. Threats to operational technology (OT) – the hardware and software dedicated to monitoring and controlling physical devices such as valves, pumps, etc. – can disrupt operations, negatively impact productivity, cause ecological damage and compromise human safety. To help mitigate this risk, a new global alliance focused on cyber security launched today. The Operational Technology Cyber Security Alliance (OTCSA) was established to help companies address the OT security challenges that continue to put operations, and consequently, business at risk.
