Diodes Incorporated and Lite-On Semiconductor Corporation today announced the companies have entered into an agreement that provides for the acquisition of LSC by Diodes.
Global Semiconductor Process Control Equipment: 6% CAGR Projection Over the Next Five Years
The global semiconductor process control equipment market is expected to post a CAGR of close to 6% during the period 2019-2023.
Amtech Announces New Order for Its 300mm HTR Furnace
Amtech Systems, Inc. announced today that its subsidiary, Bruce Technologies, Inc., has received a significant new order for its 300mm high-temp diffusion furnace from a top-tier power semiconductor customer.
Everspin Honored with Best of Show Award for Most Innovative Flash Memory Technology at Flash Memory Summit 2019
Everspin Technologies, Inc. was honored with a Flash Memory Summit 2019 Best of Show Award for most innovative flash memory technology at last night’s awards ceremony.
Toshiba Memory’s XFMEXPRESS Technology Awarded ‘Best of Show’ at Flash Memory Summit 2019
Toshiba Memory America, Inc. announced that its XFMEXPRESS technology for removable PCIe attached, NVM memory devices has received a Flash Memory Summit ‘Best of Show’ award.
Quartz Consumables Revenues a Postive Sign Amidst Equipment Sales Declines
TECHCET announced that the global market for quartz equipment consumable materials used in semiconductor manufacturing is forecasted to drop a mere ~3% to US$1.26 billion in 2019.
New Synthesis Method Opens Up Possibilities for Organic Electronics
Scientists at Tokyo Institute of Technology (Tokyo Tech) modify a previous synthesis method to create a new semiconducting polymer with remarkable properties which could be used in organic electronic devices such as thin film transistors.
Synopsys to Acquire QTronic GmbH
Synopsys, Inc. today announced it has signed a definitive agreement to acquire QTronic GmbH.
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
Nordson MARCH, a division of Nordson will present the paper, “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
Arm’s interconnect technology on GF’s 12LP process enables high performance and low latency, while increasing bandwidth for high core designs in AI, Cloud Computing and Mobile SoCs.
