Researchers have created a new type of tiny 3D-printed robot that moves by harnessing vibration from piezoelectric actuators, ultrasound sources or even tiny speakers. Swarms of these “micro-bristle-bots” might work together to sense environmental changes, move materials – or perhaps one day repair injuries inside the human body.
Worldwide Semiconductor Revenue to Decline 9.6% in 2019
Worldwide semiconductor revenue is forecast to total $429 billion in 2019, a decline of 9.6% from $475 billion in 2018, according to Gartner, Inc.
Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018
Year-to-year sales down across all regions; 2019 Q2 sales up slightly compared to Q1.
Cree and ON Semiconductor Announce Multi-Year Silicon Carbide Wafer Supply Agreement
Agreement to boost commercial expansion of SiC in automotive and industrial applications.
Toshiba Memory Unveils New Technology for Removable NVMe Memory Devices with Groundbreaking Size to Performance Ratio
Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices.
Eta Compute Appoints Dr. Ted Tewksbury Chief Executive Officer
Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices based on its revolutionary new platform, announces today the appointment of Dr. Ted Tewksbury as chief executive officer effective immediately.
Microchip Enters Memory Infrastructure Market with Serial Memory Controller for High-performance Data Center Computing
As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
Toshiba Memory Introduces XL-FLASH Storage Class Memory Solution
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH.
Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership
Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems.
A Wearable Device So Thin and Soft You Won’t Even Notice It
Device also can serve as robotic skin, relaying information back to the user.
