Physicists from Martin Luther University Halle-Wittenberg (MLU) have investigated if and how these materials might be developed. They have created, tested and filed a patent for a concept that utilises the latest findings from the field of spintronics. With their new concept, the researchers at MLU want to improve the properties of diodes and transistors. Common processors use thousands of diodes and transistors to process data.
Groundbreaking Method Detects Defective Computer Chips
Guaranteeing that computer chips, that can consist of billions of interconnected transistors, are manufactured without defects is a challenge. But how to determine if a chip is compromised? Now a technique co-developed by researchers at the Paul Scherer Institut in Switzerland and researchers at the USC Viterbi School of Engineering would allow companies and other organizations to non-destructively scan chips to ensure that they haven’t been altered and that they are manufactured to design specifications without error.
Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors
Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.
2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies
“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.
SUTD Physicists Unlock the Mystery of Thermionic Emission in Graphene
Reporting in Physical Review Applied, researchers from the Singapore University of Technology and Design (SUTD) have discovered a general theory that describes the thermionic emission from graphene. By carefully studying the electronic properties of graphene, they have constructed a generalized theoretical framework that can be used to accurately capture the thermionic emission physics in graphene and is suitable for the modeling of a wide range of graphene-based devices.
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Synopsys Completes Acquisition of QTronic GmbH
Synopsys, Inc. (NASDAQ: SNPS) today announced it has completed its acquisition of QTronic GmbH, a leader in simulation, test tools, and services for automotive software and systems development headquartered in Germany. QTronic simulation and test tools will accelerate Synopsys delivery of a comprehensive automotive virtual prototyping solution for system and software development throughout the automotive electronic supply chain.
Nova’s President & CEO, Eitan Oppenhaim, Joins its Board of Directors
Nova (NASDAQ: NVMI), an innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today the appointment of Eitan Oppenhaim, who has served as Nova’s President & Chief Executive Officer since 2013, to the company’s Board of Directors. “I am excited to join the board and have the opportunity to contribute to the team of directors,” commented Mr. Oppenhaim. “I am sure that this appointment, along with my continuous role as President and CEO, will contribute to the continuing success of our company.”
Keeping Cool with Quantum Wells
University of Tokyo researchers have announced a new approach for electrical cooling without the need for moving parts. By applying a bias voltage to quantum wells made of the semiconductor aluminum gallium arsenide, electrons can be made to shed some of their heat in a process called “evaporative cooling.” Devices based on this principle may be added to electronic circuit boards using conventional semiconductor fabrication methods to help smartphones and laptops avoid performance issues caused by high temperatures.
