The upcoming 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held in Dallas, TX from March 29 – April 2, 2020 at the Hilton DFW Lakes Executive Conference Center. The Symposium will feature a number of special focus sessions highlighting novel and emerging areas of electronic reliability, as well as topics relating to conventional semiconductor, integrated circuit, and microelectronic assembly reliability.
Acquisition Rebound Lifts 2019 to Third-Largest M&A Year
Seven major semiconductor acquisition agreements valued at $1 billion or more increase the total value of all deals by 22% from the previous year, continuing the strong wave of M&A and consolidation among chip suppliers.
SemiQ Announces Next Generation 650V, 1200V, and 1700V Silicon Carbide Schottky Diode Family
SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
FEFU Scientists Developed Method to Build Up Functional Elements of Quantum Computers
Scientists from Far Eastern Federal University (FEFU, Vladivostok, Russia), together with colleagues from FEB RAS, China, Hong Kong, and Australia, manufactured ultra-compact bright sources based on IR-emitting mercury telluride (HgTe) quantum dots (QDs), the future functional elements of quantum computers and advanced sensors. A related article is published in “Light: Science and Applications”. FEFU scientists, together with colleagues from the Far Eastern Branch of the Russian Academy of Sciences and foreign experts, designed a resonant lattice laser printed on a surface of thin gold film that allows to control the near- and mid-IR radiation properties of capping layer of mercury telluride (HgTe) QDs.
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
Technology Trends in Semiconductors, Revealed by GlobalData
Semiconductors will enable the low latency, high bandwidth, pixel-heavy world soon to be spawned by the widespread deployment of 5G, but it will require a series of industry resets involving new architectures, business models, and materials. The central challenge is to process huge volumes of data a lot faster using a much lower power draw per bit stored, processed, and moved.
Semiconductor R&D To Nudge Higher Through 2024
The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies.
A Gold Butterfly Can Make Its Own Semiconductor Skin
A nanoscale gold butterfly provides a more precise route for growing/synthesizing nanosized semiconductors that can be used in nano-lasers and other applications. Hokkaido University researchers have devised a unique approach for making nanosized semiconductors on a metal surface. The details of the method were reported in the journal Nano Letters and could further research into the fabrication of nanosized light and energy emitters.
MEMS-FHE Device Integration Gets Real
MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.
Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020
VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high.
