Silvaco Japan Co., Ltd. today announced that Pioneer Micro Technology Corp. (PMT) has begun providing a Process Development Kit (PDK) for Silvaco tool users targeting the manufacture of IC designs in PMT’s 0.35 µm CMOS process technology.
Semiconductor Intellectual Property (IP) Market to Grow at 8.8% During 2018-2026 on the Back of Advancements in Multi-core Technology
The global semiconductor intellectual property market is prognosticated to expand at steady CAGR of 8.8% within the forecast period from 2018 to 2026. By the end of 2026, the semiconductor IP market is likely to be valued around worth US$ 9,437.8 mn.
Magnetite Nanowires with Sharp Insulating Transition
Osaka University-led researchers make ultra-thin nanowires of Fe3O4, with a remarkable ‘Verwey transition’ from metal to insulator at low temperature — a highly sought-after property for nanoelectronics.
Electronic Chip Mimics the Brain to Make Memories in a Flash
Engineers have mimicked the human brain with an electronic chip that uses light to create and modify memories.
Alpha and Omega Semiconductor Introduces New Source Down Packaging Technology
Alpha and Omega Semiconductor Limited today introduced the “Source Down” in a DFN 5×6 package in combination with a 40V Shield-Gate Technology.
SiC and GaN-based Power Electronics to Boost Automotive Semiconductor Efficiencies and Profitability
Strategy Analytics predicts that as HEV/EV (hybrid electric vehicle/electric vehicle) platforms become a greater proportion of the global vehicle manufacturing mix, the demand for power electronic components will account for over 55% of the total semiconductor demand from HEV/EV powertrain by…
Limitation Exposed in Promising Quantum Computing Material
Metallic surfaces no longer protected as topological insulators become thinner.
Breakthrough Material Could Lead to Cheaper, More Widespread Solar Panels and Electronics
Two physics research groups at the University of Kansas have generated free electrons from organic semiconductors when combined with a single atomic layer of molybdenum disulfide, a recently discovered two-dimensional semiconductor.
Intel Unveils New Tools in Its Advanced Packaging Toolbox
Last week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.
SEMI Teams with FIRST Global to Inspire Young Students Worldwide to Pursue STEM Educations and Careers
SEMI, the global industry association representing the electronics design and manufacturing supply chain, today announced a memorandum of understanding (MOU) with FIRST Global, a non-profit that organizes the FIRST Global Challenge, an annual international robotics event dedicated to inspiring a passion for STEM (Science, Technology, Engineering and Math) among young students worldwide.
