Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

MagnaChip Semiconductor CEO YJ Kim Awarded Korea’s Prestigious Industrial Service Medal

MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that CEO YJ Kim was awarded the Industrial Service Medal by the Korean Government in acknowledgement of his efforts to attract investment and encourage job development in Korea. The medal was presented today at the annual ‘Foreign Company Day’ ceremony hosted by the Korea Ministry of Industry, Trade and Energy, and the Korea Foreign Company Association (FORCA).

2D Antimony Holds Promise For Post-Silicon Electronics

Not everything is bigger in Texas — some things are really, really small. A group of engineers at The University of Texas at Austin may have found a new material for manufacturing even smaller computer chips that could replace silicon and help overcome one of the biggest challenges facing the tech industry in decades: the inevitable end of Moore’s Law. Researchers in the Cockrell School of Engineering are searching for other materials with semiconducting properties that could form the basis for an alternative chip. Yuanyue Liu, an assistant professor in the Walker Department of Mechanical Engineering and a member of UT’s Texas Materials Institute, may have found that material.

SEMI 3D & Systems Summit to Spotlight Latest in 3D Roadmap, Heterogeneous Integration and System-in-Package Technologies

Top experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies. 3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications. Registration is now open with early-bird pricing until 30 November, 2019.

Broadcom Completes Acquisition of Symantec Enterprise Security Business

Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that it has completed its acquisition of the Enterprise Security business of Symantec Corporation (NASDAQ: SYMC). Symantec’s Enterprise Security business will now operate as the Symantec Enterprise division of Broadcom and will be led by Art Gilliland as SVP and General Manager.

Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $106.7 billion during the third quarter of 2019, an increase of 8.2 percent over the previous quarter and 14.6 percent less than the third quarter of 2018.

Boston Semi Equipment Revolutionizes Handling of Multi-Port, Low Pressure MEMS Sensors

Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and an innovative provider of test automation technical services, announced today that it has enhanced its Zeus gravity feed handlers with the capability of handling extremely low pressure MEMS devices with multiple ports. The first to benefit from this new MEMS handling capability is a leading manufacturer of health monitoring systems who selected BSE’s Zeus pressure MEMS solution for the ability to provide the extremely low-pressure stimulus combined with higher throughput. The Zeus MEMS handler is faster, more economical, and requires significantly less floor space than their existing solution.

Scientists Spy Unstable Semiconductors

Scientists from Cardiff University have, for the first time, spotted previously unseen “instabilities” on the surface of a common compound semiconductor material. The findings could potentially have profound consequences for the development of future materials in the electronic devices that power our daily lives.

New Technique Lets Researchers Map Strain in Next-Gen Solar Cells

People can be good at hiding strain, and we’re not alone. Solar cells have the same talent. For a solar cell, physical strain within its microscopic crystalline structure can interrupt its core function — converting sunlight into electricity — by essentially “losing” energy as heat. For an emerging type of solar cell, known as lead halide perovskites, reducing and taming this loss is key to improving efficiency and putting the perovskites on par with today’s silicon solar cells.In order to understand where strain builds up within a solar cell and triggers the energy loss, scientists must visualize the underlying grain structure of perovskite crystals within the solar cell. But the best approach involves bombarding the solar cell with high-energy electrons, which essentially burns the solar cell and renders it useless.

Gigaphoton Establishes New Company in China

Gigaphoton Inc. (Head Office: Oyama, Tochigi; President & CEO: Katsumi Uranaka), a manufacturer of light sources used in semiconductor lithography, announced the establishment and start of business for a new company GIGAPHOTON CHINA Inc. in China. Up until now, Gigaphoton’s service support in China has been conducted by Komatsu Industries Shanghai Ltd.’s optical machinery division. To expand business in China and strengthen governance, Gigaphoton China Inc. has been established as a subsidiary of Komatsu China Ltd., the regional headquarters of Komatsu, which is the parent company of Gigaphoton. Effective November 1, control of operations is transferred from Komatsu Industries Shanghai Ltd. to Gigaphoton China Inc.

Preventing Yield Losses a Key Topic of Critical Materials Council Meetings and Seminar

At the recently concluded TECHCET Critical Materials Council (CMC) Seminar in Taoyuan, Taiwan, a diverse gathering of industry experts discussed materials value-chain topics including quality issues, logistics best practices, and geopolitical disruptions. Seminar participants included individuals from device makers, material suppliers, and equipment and component providers from China, Europe, Japan, South Korea, Taiwan, and the U.S.