Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Hermetically Sealed Semiconductors

Tomorrow’s electronics are getting ever smaller. Researchers are thus searching for tiny components that function reliably in increasingly narrow configurations. Promising elements include the chemical compounds indium selenide (InSe) and gallium selenide (GaSe). In the form of ultra-thin layers, they form two-dimensional (2D) semiconductors. But, so far, they have hardly been used because they degrade when they get in contact with air during manufacturing. Now, a new technique allows the sensitive material to be integrated in electronic components without losing its desired properties. The method, which has been described in the journal ACS Applied Materials and Interfaces (DOI: 10.1021/acsami.9b13442), was developed by Himani Arora, a doctoral candidate of physics at the Helmholtz-Zentrum Dresden-Rossendorf (HZDR).

Cisco Appoints AMD President and CEO Dr. Lisa T. Su to Board of Directors

Cisco today announced the appointment of Dr. Lisa T. Su, AMD president and CEO, to its board of directors effective today. “Lisa is an accomplished business leader with deep expertise in the semiconductor industry,” said Chuck Robbins, chairman and CEO, Cisco. “We look forward to her contributions to Cisco’s board and our business as we continue to develop ground breaking technologies, and a new internet for the 5G era that will help our customers innovate faster than ever before.”

Cree, Inc. Appoints Glenda Dorchak to Board of Directors

Cree, Inc. (Nasdaq: CREE), the global leader in silicon carbide technology, announces that Glenda Dorchak, a seasoned corporate operating executive and experienced director, has been appointed to the Company’s Board of Directors, effective January 27, 2020. Ms. Dorchak has served as a director of Mellanox Technologies, Ltd. (Nasdaq: MLNX) since July 2009. Additionally, she serves as a director of Viavi Solutions Inc. (Nasdaq: VIAV), ANSYS. Inc. (Nasdaq; ANSS), and GlobalFoundries, a private semiconductor foundry.

JEDEC Honors Dr. Howard Yang of Montage Technology With New Award

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced that Dr. Howard Yang, co-founder, Chairman and CEO of Montage Technology, is an inaugural recipient of the JEDEC Distinguished Executive Leadership Award. The JEDEC Distinguished Executive Leadership Award honors the most distinguished senior executives in the electronics industry who have promoted and supported the advancement of JEDEC standards. Recipients of this award are making the industry better through their long-term support for JEDEC participation at both the strategic and managerial levels of open standards development.

Detection of Very High Frequency Magnetic Resonance Could Revolutionize Electronics

A team of physicists has discovered an electrical detection method for terahertz electromagnetic waves, which are extremely difficult to detect. The discovery could help miniaturize the detection equipment on microchips and enhance sensitivity. The finding, reported today in Nature, is based on a magnetic resonance phenomenon in anti-ferromagnetic materials. Such materials, also called antiferromagnets, offer unique advantages for ultrafast and spin-based nanoscale device applications.

EUV Lithography Market to Exhibit 22% CAGR Through 2029, Demand Buoyed by Miniaturization of Electronics & Semiconductors

Miniaturization of integrated circuits and microchips, elevated wafer production, and consistent growth of the semiconductors industry are anticipated to propel the adoption of EUV lithography into chip manufacturing across the globe. EUV lithography market is estimated for a staggering CAGR of 22% during the forecast period of 2019-2029.

Littelfuse Appoints Maria C. Green to Board of Directors

Littelfuse, Inc. (NASDAQ: LFUS), a global manufacturer of leading technologies in circuit protection, power control and sensing, announced today the appointment of Maria C. Green, retired Senior Vice President and General Counsel of Ingersoll-Rand plc (NYSE: IR), to the company’s board of directors, effective February 1, 2020.

Detection of Very High Frequency Magnetic Resonance Could Revolutionize Electronics

A team of physicists has discovered an electrical detection method for terahertz electromagnetic waves, which are extremely difficult to detect. The discovery could help miniaturize the detection equipment on microchips and enhance sensitivity. The researchers, led by physicist Jing Shi of the University of California, Riverside, generated a spin current, an important physical quantity in spintronics, in an antiferromagnet and were able to detect it electrically. To accomplish this feat, they used terahertz radiation to pump up magnetic resonance in chromia to facilitate its detection.

Rice Lab Turns Trash Into Valuable Graphene in a Flash

That banana peel, turned into graphene, can help facilitate a massive reduction of the environmental impact of concrete and other building materials. While you’re at it, toss in those plastic empties. A new process introduced by the Rice University lab of chemist James Tour can turn bulk quantities of just about any carbon source into valuable graphene flakes. The process is quick and cheap; Tour said the “flash graphene” technique can convert a ton of coal, food waste or plastic into graphene for a fraction of the cost used by other bulk graphene-producing methods.

SEMI 3D & Systems Summit Opens – Highlights Advanced Packaging for Emerging Technologies

The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, 3D roadmap and System-In-Package (SiP) technologies.