The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced key advancements and activities designed to enhance advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and other automotive applications. Trends such as the proliferation of camera, display, radar, lidar and other sensors are creating growing demand for high-performance wired interfaces in vehicles. While drawing on its existing specifications for mobile devices, MIPI is developing and enhancing automotive specifications to meet the stringent requirements of automotive OEMs, Tier 1 suppliers, SoC designers and other industry providers in areas such as reliability, functional safety and low electromagnetic interference (EMI).
Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm “Hercules” Processor on 5LPE Process
Synopsys, Inc. today announced that Synopsys, Arm, and Samsung have actively collaborated on solutions to enable early adoption of the next-generation Arm-based processor. Design-ready solutions are based on the artificial intelligence (AI)-enhanced, cloud-ready Fusion Design Platform from Synopsys, along with Arm Artisan Physical IP and POP IP for Samsung Foundry’s advanced 5LPE process. These solutions will accelerate development of the next wave of semiconductor system-on-chips (SoCs), including designs for high-performance computing (HPC), automotive, 5G, and AI market segments. The collaboration will help customers optimize power, performance, and area (PPA), and achieve faster time-to-market while providing full-flow quality-of-results (QoR) and time-to-results (TTR).
Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs
Synopsys, Inc. (Nasdaq: SNPS) today announced the industry’s first and most comprehensive unified functional safety verification solution to accelerate time to ISO 26262 certification for automotive IP and semiconductor companies targeting the highest Automotive Safety Integrity Levels (ASIL D). As part of the solution, Synopsys introduced VC Functional Safety Manager, a FMEA/FMEDA and fault classification automation technology enabling architects, IP designers, and verification engineers to accelerate their functional safety verification with productivity gains up to 50 percent compared to traditional manual and error-prone functional safety verification point tools.
Patented Concept from Halle: Novel, High-Performance Diodes and Transistors
Physicists from Martin Luther University Halle-Wittenberg (MLU) have investigated if and how these materials might be developed. They have created, tested and filed a patent for a concept that utilises the latest findings from the field of spintronics. With their new concept, the researchers at MLU want to improve the properties of diodes and transistors. Common processors use thousands of diodes and transistors to process data.
Groundbreaking Method Detects Defective Computer Chips
Guaranteeing that computer chips, that can consist of billions of interconnected transistors, are manufactured without defects is a challenge. But how to determine if a chip is compromised? Now a technique co-developed by researchers at the Paul Scherer Institut in Switzerland and researchers at the USC Viterbi School of Engineering would allow companies and other organizations to non-destructively scan chips to ensure that they haven’t been altered and that they are manufactured to design specifications without error.
Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors
Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.
2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies
“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.
SUTD Physicists Unlock the Mystery of Thermionic Emission in Graphene
Reporting in Physical Review Applied, researchers from the Singapore University of Technology and Design (SUTD) have discovered a general theory that describes the thermionic emission from graphene. By carefully studying the electronic properties of graphene, they have constructed a generalized theoretical framework that can be used to accurately capture the thermionic emission physics in graphene and is suitable for the modeling of a wide range of graphene-based devices.
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
