Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World

Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.

Plasma-Therm Announces Cooperation with Everspin Technologies Inc.

Everspin Technologies, Inc. has entered into an agreement with Plasma-Therm, allowing Everspin to use the 8-inch Pinnacle Ion Beam Etch System for advanced STT-MRAM materials and etch development in conjunction with their Chandler 8-inch facility.

Alertgy and Okmetic Oy Win for Top MEMS and Imaging Sensors Innovations at Technology Summit

SEMI today announced Alertgy and Okmetic Oy as winners of the SEMI MEMS & Imaging Sensors SummitTechnology Showcase. The Alertgy non-invasive glucose monitor was crowned the best imaging technology, and the Okmetic Oy silicon substrate manufacturing platform was the winning MEMS technology. Attendees voted for the top technology in each category among 10 finalists selected by a committee of industry experts.

Mitsubishi Electric Develops Trench-type SiC-MOSFET with Unique Electric-field-limiting Structure

Mitsubishi Electric Corporation announced today that it has developed a trench-type silicon-carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) with a unique electric-field-limiting structure for a power semiconductor device that achieves a world-leading specific on-resistance of 1.84 mΩ (milliohms) cm2 and a breakdown voltage of over 1,500 V.

Gartner Says Global Device Shipments Will Decline 3.7% in 2019

Worldwide shipments of devices — PCs, tablets and mobile phones — will decline 3.7% in 2019, according to the latest forecast from Gartner, Inc. Gartner estimates there are more than 5 billion mobile phones used around the world. After years of growth, the worldwide smartphone market has reached a tipping point. Sales of smartphones will decline by 3.2% in 2019, which would be the worst decline the category has seen.

MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics

Highlighting the world’s first DNA search engine, 4D LiDAR for autonomous vehicles, wearable biosensors for healthcare and other innovations, MEMS & Sensors Industry Group, a SEMI Strategic Association Partner, today announced Technology Showcase finalists for the 15thannual MEMS & Sensors Executive Congress (MSEC), October 22-24, 2019 at Coronado Island Marriott Resort & Spa in Coronado, Calif.

Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022

Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. ecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in 2021, and 12,785 million square inches in 2022.

CCNY Physicists Score Double Hit in LED Research

In two breakthroughs in the realm of photonics, City College of New York graduate researchers are reporting the successful demonstration of an LED (light-emitting diode) based on half-light half-matter quasiparticles in atomically thin materials. This is also the first successful test of an electrically driven light emitter using atomically thin semiconductors embedded in a light trapping structure (optical cavity).

Plessey Launches a MicroLED Direct-Drive Display Platform

Plessey, an embedded technologies developer at the forefront of microLED technology for augmented and mixed reality (AR/MR) display applications has introduced a microLED Direct-Drive display platform and development kit, based on its proprietary monolithic GaN-on-Silicon technology. Plessey’s Direct-Drive displays provide OEM’s and product developers with a solution to retrofit current products or develop new concept designs, around a compact, flexible and highly efficient microLED display.

Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements

Synopsys, Inc. (Nasdaq: SNPS) today announced it has achieved certification for dozens of new, innovative features to the Synopsys Digital and Custom Design Platforms on TSMC’s most advanced 5nm process technology, required for high-performance computing (HPC) and mobile chip designs. In addition to certification of HPC and mobile design flows, Synopsys has also achieved the certification for its design tools on TSMC’s industry-leading N5P and N6 process technologies, enabling early customer design work.