What may be viewed as the world’s smallest incandescent lightbulb is shining in a Rice University engineering laboratory with the promise of advances in sensing, photonics and perhaps computing platforms beyond the limitations of silicon. Gururaj Naik of Rice’s Brown School of Engineering and graduate student Chloe Doiron have assembled unconventional “selective thermal emitters” — collections of near-nanoscale materials that absorb heat and emit light.
The Future of ‘Extremely’ Energy-Efficient Circuits
Data centers are processing data and dispensing the results at astonishing rates and such robust systems require a significant amount of energy — so much energy, in fact, that information communication technology is projected to account for 20% of total energy consumption in the United States by 2020. To answer this demand, a team of researchers from Japan and the United States have developed a framework to reduce energy consumption while improving efficiency.
Scientists Create Fully Electronic 2-Dimensional Spin Transistors
Physicists from the University of Groningen constructed a two-dimensional spin transistor, in which spin currents were generated by an electric current through graphene.
SEMICON Taiwan 2019 Opens with Smart Tech, Innovation, Digital Future in Spotlight
With Taiwan expected to lead the world in semiconductor equipment investments in 2019, SEMICON Taiwan 2019 opens today, gathering the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data. September 18-20 at Nangang Exhibition Center, Hall I, in Taipei, SEMICON Taiwan 2019 spans the entire semiconductor and microelectronics supply chain – from design through systems.
ZEISS Accelerates Time to Market for Advanced Semiconductor Packages with Non-destructive 3D X-ray Measurement Solution
ZEISS today introduced the ZEISS Xradia 620 Versa RepScan — a submicron-resolution, 3D non-destructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages.
D2S Enables “Stitchless” Full-Chip Inverse Lithography Technology in a Single Day for The Multi-Beam Era
D2S today introduced TrueMask® ILT, a GPU-accelerated hardware and software system that enables IC manufacturers to implement stitchless, full-chip inverse lithography technology (ILT) for advanced-node designs in a single day.
Intel Updates Advanced Packaging Technologies at SEMICON West Part 2
At the Architecture Day Intel demoed a Foveros-based part, comprising a high-performance 10-nm chiplet on a low-power 22nm base die. The upper die contained five cores, four Atom low-power cores and a high-performance core, and as shown in the Intel image above, the two lower dies were stacked with PoP memory, all in a 12 x 12 mm package with 2mW standby power.
Light and Sound In Silicon Chips: The Slower The Better
Integrated circuits in silicon enable our digital era. The capabilities of electronic circuits have been extended even further with the introduction of photonics: components for the generation, guiding and detection of light. Together, electronics and photonics support entire systems for data communication and processing, all on a chip. However, there are certain things that even electrical and optical signals can’t do simply because they move too fast.
Paramagnetic Spins Take Electrons for a Ride, Produce Electricity From Heat
An international team of researchers has observed that local thermal perturbations of spins in a solid can convert heat to energy even in a paramagnetic material – where spins weren’t thought to correlate long enough to do so. The research team includes scientists from North Carolina State University, the Department of Energy’s Oak Ridge National Laboratory (ORNL), the Chinese Academy of Sciences and the Ohio State University.
Semiconductor Industry Veteran Bee Bee Ng New SEMI Southeast Asia President
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that semiconductor industry veteran Bee Bee Ng has joined SEMI as president of SEMI Southeast Asia, reporting to SEMI CFO Richard Salsman. Based in Singapore, Ng will direct SEMI Southeast Asia sales and services; expositions and programs including standards, EHS, workforce development and advocacy; and administrative operations.
