Marvell (NASDAQ: MRVL) today announced that it has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GLOBALFOUNDRIES. After working capital adjustments, the net deal consideration of approximately $600 million is being funded by a short-term bridge loan. By combining Marvell’s advanced technology platform and scale with Avera’s custom design capabilities, Marvell is now able to offer the complete spectrum of semiconductor solutions spanning 5G, data center, enterprise, and automotive applications.
Light-Based ‘Tractor Beam’ Assembles Materials at the Nanoscale
Modern construction is a precision endeavor. Builders must use components manufactured to meet specific standards — such as beams of a desired composition or rivets of a specific size. The building industry relies on manufacturers to create these components reliably and reproducibly in order to construct secure bridges and sound skyscrapers. Now imagine construction at a smaller scale — less than 1/100th the thickness of a piece of paper. This is the nanoscale. It is the scale at which scientists are working to develop potentially groundbreaking technologies in fields like quantum computing. It is also a scale where traditional fabrication methods simply will not work. Our standard tools, even miniaturized, are too bulky and too corrosive to reproducibly manufacture components at the nanoscale.
Renesas and Altair Semiconductor Announce Collaboration for Cellular IoT Solutions
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Altair Semiconductor (altair-semi.com), a leading provider of cellular IoT chipsets, jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market. Cellular IoT device makers will be able to use this combination of best-in-class solutions to create highly differentiated IoT products and services that offer much greater efficiencies and faster time to market. These integrated solutions will be delivered through Renesas’ sales channels, enabling cellular connectivity to all of its markets.
MagnaChip Semiconductor CEO YJ Kim Awarded Korea’s Prestigious Industrial Service Medal
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that CEO YJ Kim was awarded the Industrial Service Medal by the Korean Government in acknowledgement of his efforts to attract investment and encourage job development in Korea. The medal was presented today at the annual ‘Foreign Company Day’ ceremony hosted by the Korea Ministry of Industry, Trade and Energy, and the Korea Foreign Company Association (FORCA).
2D Antimony Holds Promise For Post-Silicon Electronics
Not everything is bigger in Texas — some things are really, really small. A group of engineers at The University of Texas at Austin may have found a new material for manufacturing even smaller computer chips that could replace silicon and help overcome one of the biggest challenges facing the tech industry in decades: the inevitable end of Moore’s Law. Researchers in the Cockrell School of Engineering are searching for other materials with semiconducting properties that could form the basis for an alternative chip. Yuanyue Liu, an assistant professor in the Walker Department of Mechanical Engineering and a member of UT’s Texas Materials Institute, may have found that material.
SEMI 3D & Systems Summit to Spotlight Latest in 3D Roadmap, Heterogeneous Integration and System-in-Package Technologies
Top experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies. 3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications. Registration is now open with early-bird pricing until 30 November, 2019.
Broadcom Completes Acquisition of Symantec Enterprise Security Business
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that it has completed its acquisition of the Enterprise Security business of Symantec Corporation (NASDAQ: SYMC). Symantec’s Enterprise Security business will now operate as the Symantec Enterprise division of Broadcom and will be led by Art Gilliland as SVP and General Manager.
Global Semiconductor Sales Increase 3.4 Percent Month-to-Month in September
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $106.7 billion during the third quarter of 2019, an increase of 8.2 percent over the previous quarter and 14.6 percent less than the third quarter of 2018.
Boston Semi Equipment Revolutionizes Handling of Multi-Port, Low Pressure MEMS Sensors
Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and an innovative provider of test automation technical services, announced today that it has enhanced its Zeus gravity feed handlers with the capability of handling extremely low pressure MEMS devices with multiple ports. The first to benefit from this new MEMS handling capability is a leading manufacturer of health monitoring systems who selected BSE’s Zeus pressure MEMS solution for the ability to provide the extremely low-pressure stimulus combined with higher throughput. The Zeus MEMS handler is faster, more economical, and requires significantly less floor space than their existing solution.
Scientists Spy Unstable Semiconductors
Scientists from Cardiff University have, for the first time, spotted previously unseen “instabilities” on the surface of a common compound semiconductor material. The findings could potentially have profound consequences for the development of future materials in the electronic devices that power our daily lives.
