OneSpin® Solutions, provider of certified IC integrity verification solutions for building functionally correct, safe, secure and trusted integrated circuits, will present its verification expertise through a tutorial, technical session and an exhibit at DVCon Europe, being held October 29 – 30, 2019 at the Holiday Inn Munich City Centre, Munich, Germany.
Power Integrations Announces Settlement of Patent Litigation
Power Integrations (Nasdaq: POWI) today announced a comprehensive settlement of its patent disputes with ON Semiconductor and its subsidiary, Fairchild Semiconductor. Consistent with the terms of the term sheet disclosed on October 9, the companies have entered into a definitive agreement that ends all litigation between them, including lawsuits in Delaware, California, Taiwan and China. Power Integrations (PI) has received a cash payment of $175M from ON; neither company granted any licenses to the other.
Dr. Necip Sayiner Joins Rambus Board of Directors
Rambus Inc. (NASDAQ: RMBS), a silicon IP and chip provider dedicated to delivering data faster and safer, today announced the appointment of Dr. Necip Sayiner to its Board of Directors, effective immediately. With over twenty-five years of semiconductor expertise, Dr. Sayiner is an experienced executive with a proven track record of successfully increasing company revenue growth and profitability. Prior to joining the Rambus board, he was executive vice president and general manager at Renesas Electronics Corporation, following their acquisition of Intersil, where he served as president and CEO.
Renesas Expands Access to Portfolio of Leading-Edge IP Licenses
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced expanded access to its highly sought portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customer requirements in a rapidly changing industry. Starting today, customers will have access to IPs such as advanced 7nm (nanometer) SRAM and TCAM, and leading-edge standard Ethernet time-sensitive networking (TSN) IP. Furthermore, Renesas is working on providing a system IP which includes PIM (processing in memory), which attracted attention as an AI accelerator, presented in a conference paper in June 2019.
Micron Brings 3D XPoint Technology to Market With the World’s Fastest SSD
Micron Technology, Inc. (Nasdaq: MU), today announced a breakthrough in nonvolatile memory technology with the introduction of the world’s fastest SSD, the Micron X100 SSD. The Micron X100 SSD is the first solution in a family of products from Micron targeting storage- and memory-intensive applications for the data center. These solutions will leverage the strengths of 3D XPoint technology and usher in a new tier in the memory-to-storage hierarchy with higher capacity and persistence than DRAM, along with higher endurance and performance than NAND.
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
StratEdge Corporation announced its assembly services for attaching gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) onto copper-molybdenum-copper (CMC) tabs. StratEdge’s proprietary eutectic die attach method maximizes the power output a chip can achieve, optimizing its performance and providing an efficient way to dissipate heat to avoid overheating and failures during normal operation.
Intel Introduces Tremont Microarchitecture
Today at the Linley Fall Processor Conference in Santa Clara, Calif., Intel revealed the first architectural details related to Tremont. Intel’s newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations.
Semiconductor Acquisitions Regain Momentum in 2019
After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019 with the combined value of about 20 M&A agreement announcements reaching $28.0 billion for the purchase of chip companies, business units, product lines, intellectual property (IP), and wafer fabs between January and the end of August.
ASE Group Significantly Advances Semiconductor Packaging Development With ANSYS Customization Toolkit Solution
ASE Group (ASE) engineers have drastically improved their integrated circuit (IC) semiconductor packaging and development process to create state-of-the-art microchips thanks to ANSYS (NASDAQ: ANSS). Developing an ANSYS Customization Toolkit (ACT) solution, engineers create more accurate models, enhance structural reliability and slash design time to enable customers to receive products faster than ever.
Award-winning Lattice sensAI Solutions Stack Further Extends Lead in Ultra Low-power AI at the Edge
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of performance enhancements and new and improved application reference designs for its award-winning sensAI™ solutions stack. sensAI helps OEMs develop AI and ML experiences for next-generation smart devices with power consumption measured in milliwatts.
