Transparent conductive films (TCFs) have many applications in touch screens, organic light emitting diodes and solar cells. These applications need materials that are strong, energy efficient and stable, which is why companies and researchers are interested in carbon-based materials. This applies especially to networks of single-walled carbon nanotubes, which are expected to replace the metal-oxide films that are currently used. In an article published in ACS Nano, scientists at Aalto University and the University of Vienna introduce a hybrid material made by combining carbon nanotubes and graphene, which improves the conductivity of the film beyond what is possible when using each of these component structures separately.
TSMC’s Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
Taiwan Semiconductor Manufacturing Company’s heavy investments in advanced wafer-fab technology are set to pay off significantly for the world’s largest silicon foundry as it continues the production ramp of 7nm ICs in the second half of this year, according to an analysis in IC Insights’ September Update to the 2019 McClean Report.
New Approach For Modern Power Grids That Increases Efficiency, Reduces Cost
Modern power grids are rapidly developing due to the increasing penetration of renewable energy sources such as solar photovoltaic and wind power. This trend is expected to rise in the near future, as attested by major countries worldwide in their commitments to the production of large renewable power penetration. A modern power grid, with its reduced dependence on non-renewable energy, has indisputable advantages in terms of environmental safeguards, but its introduction does not come without a cost.
Eta Compute Executives To Present at the Industry’s Leading Events This Fall
Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices using its revolutionary new platform, announced it will have a major presence at the industry’s most prestigious events this fall. “Our growing presence at these important industry events is a testament to the impact Eta Compute’s AI solutions are having on extreme edge computing,” said Eta Compute’s CEO Ted Tewksbury. “Our products are becoming increasingly recognized as technologies that will have a tremendous impact on our lives and our future.”
Lenovo and Intel Power Computational Research at the Flatiron Institute
Lenovo and Intel today revealed how their collaboration on joint technology solutions that accelerate the convergence of high-performance computing (HPC) and artificial intelligence (AI) is helping scientists at the Flatiron Institute solve scientific challenges in entirely new ways. The Flatiron Institute, located in New York City, is the internal research division of the Simons Foundation, whose mission is to advance the frontiers of research in mathematics and the basic sciences. Flatiron’s Scientific Computing Core supports scientific work there across four disciplines, requiring an HPC infrastructure to handle a variety of extremely large data files, from giant genomic sequencing files to 100,000 small files in a single directory.
MIPI Alliance Advances Activities for ADAS, ADS and Other Automotive Applications
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced key advancements and activities designed to enhance advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and other automotive applications. Trends such as the proliferation of camera, display, radar, lidar and other sensors are creating growing demand for high-performance wired interfaces in vehicles. While drawing on its existing specifications for mobile devices, MIPI is developing and enhancing automotive specifications to meet the stringent requirements of automotive OEMs, Tier 1 suppliers, SoC designers and other industry providers in areas such as reliability, functional safety and low electromagnetic interference (EMI).
Synopsys, Arm, and Samsung Foundry Enable Accelerated Development of Next-Generation Arm “Hercules” Processor on 5LPE Process
Synopsys, Inc. today announced that Synopsys, Arm, and Samsung have actively collaborated on solutions to enable early adoption of the next-generation Arm-based processor. Design-ready solutions are based on the artificial intelligence (AI)-enhanced, cloud-ready Fusion Design Platform from Synopsys, along with Arm Artisan Physical IP and POP IP for Samsung Foundry’s advanced 5LPE process. These solutions will accelerate development of the next wave of semiconductor system-on-chips (SoCs), including designs for high-performance computing (HPC), automotive, 5G, and AI market segments. The collaboration will help customers optimize power, performance, and area (PPA), and achieve faster time-to-market while providing full-flow quality-of-results (QoR) and time-to-results (TTR).
Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs
Synopsys, Inc. (Nasdaq: SNPS) today announced the industry’s first and most comprehensive unified functional safety verification solution to accelerate time to ISO 26262 certification for automotive IP and semiconductor companies targeting the highest Automotive Safety Integrity Levels (ASIL D). As part of the solution, Synopsys introduced VC Functional Safety Manager, a FMEA/FMEDA and fault classification automation technology enabling architects, IP designers, and verification engineers to accelerate their functional safety verification with productivity gains up to 50 percent compared to traditional manual and error-prone functional safety verification point tools.
Patented Concept from Halle: Novel, High-Performance Diodes and Transistors
Physicists from Martin Luther University Halle-Wittenberg (MLU) have investigated if and how these materials might be developed. They have created, tested and filed a patent for a concept that utilises the latest findings from the field of spintronics. With their new concept, the researchers at MLU want to improve the properties of diodes and transistors. Common processors use thousands of diodes and transistors to process data.
Groundbreaking Method Detects Defective Computer Chips
Guaranteeing that computer chips, that can consist of billions of interconnected transistors, are manufactured without defects is a challenge. But how to determine if a chip is compromised? Now a technique co-developed by researchers at the Paul Scherer Institut in Switzerland and researchers at the USC Viterbi School of Engineering would allow companies and other organizations to non-destructively scan chips to ensure that they haven’t been altered and that they are manufactured to design specifications without error.
