Intel today unveiled its latest lineup of Intel Xeon W and X-series processors, which puts new classes of computing performance and AI acceleration into the hands of professional creators and PC enthusiasts. Custom-designed to address the diverse needs of these growing audiences, the new Xeon W-2200 and X-series processors are targeted to be available starting November, along with a new pricing structure that represents an easier step up for creators and enthusiasts from Intel Core S-series mainstream products. Intel is the only company that delivers a full portfolio of products precision-tuned to handle the sustained compute-intensive workloads used by professional creators and enthusiasts every day.
2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies
“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.
SUTD Physicists Unlock the Mystery of Thermionic Emission in Graphene
Reporting in Physical Review Applied, researchers from the Singapore University of Technology and Design (SUTD) have discovered a general theory that describes the thermionic emission from graphene. By carefully studying the electronic properties of graphene, they have constructed a generalized theoretical framework that can be used to accurately capture the thermionic emission physics in graphene and is suitable for the modeling of a wide range of graphene-based devices.
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Synopsys Completes Acquisition of QTronic GmbH
Synopsys, Inc. (NASDAQ: SNPS) today announced it has completed its acquisition of QTronic GmbH, a leader in simulation, test tools, and services for automotive software and systems development headquartered in Germany. QTronic simulation and test tools will accelerate Synopsys delivery of a comprehensive automotive virtual prototyping solution for system and software development throughout the automotive electronic supply chain.
Nova’s President & CEO, Eitan Oppenhaim, Joins its Board of Directors
Nova (NASDAQ: NVMI), an innovator and key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today the appointment of Eitan Oppenhaim, who has served as Nova’s President & Chief Executive Officer since 2013, to the company’s Board of Directors. “I am excited to join the board and have the opportunity to contribute to the team of directors,” commented Mr. Oppenhaim. “I am sure that this appointment, along with my continuous role as President and CEO, will contribute to the continuing success of our company.”
Keeping Cool with Quantum Wells
University of Tokyo researchers have announced a new approach for electrical cooling without the need for moving parts. By applying a bias voltage to quantum wells made of the semiconductor aluminum gallium arsenide, electrons can be made to shed some of their heat in a process called “evaporative cooling.” Devices based on this principle may be added to electronic circuit boards using conventional semiconductor fabrication methods to help smartphones and laptops avoid performance issues caused by high temperatures.
Exoplanets to Medical Tests: Tiny Frequency Devices Open Up New Applications
Accurately measuring frequencies of light is required for timekeeping. It’s also a critical component in many science experiments and technologies, from military defense to detecting air pollution, tests of fundamental physics to the detection of exoplanets. “There are few human enterprises that are both more fundamental and more important for technology,” says Curtis Menyuk, professor of Computer Science and Electrical Engineering at UMBC.
ClassOne’s Solstice Plating System Chosen by Taiwanese Semiconductor Foundry Yee Wei
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice electroplating system to Yee Wei Co., Ltd , a semiconductor manufacturing foundry based in Taiwan. The Solstice will be installed in Yee Wei’s manufacturing facility in Toufen City, Taiwan. The Solstice family of wet-processing tools includes the 8-chamber Solstice S8, the 4-chamber Solstice S4 and the 2-chamber Solstice LT. The Solstice platform was specifically designed for ≤200mm wafers, which are used in compound semiconductor, emerging technologies, and numerous other fabs worldwide.
