TECHCET announced that the global market for quartz equipment consumable materials used in semiconductor manufacturing is forecasted to drop a mere ~3% to US$1.26 billion in 2019.
New Synthesis Method Opens Up Possibilities for Organic Electronics
Scientists at Tokyo Institute of Technology (Tokyo Tech) modify a previous synthesis method to create a new semiconducting polymer with remarkable properties which could be used in organic electronic devices such as thin film transistors.
Synopsys to Acquire QTronic GmbH
Synopsys, Inc. today announced it has signed a definitive agreement to acquire QTronic GmbH.
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
Nordson MARCH, a division of Nordson will present the paper, “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
Arm’s interconnect technology on GF’s 12LP process enables high performance and low latency, while increasing bandwidth for high core designs in AI, Cloud Computing and Mobile SoCs.
Tiny Vibration-Powered Robots Are the Size of the World’s Smallest Ant
Researchers have created a new type of tiny 3D-printed robot that moves by harnessing vibration from piezoelectric actuators, ultrasound sources or even tiny speakers. Swarms of these “micro-bristle-bots” might work together to sense environmental changes, move materials – or perhaps one day repair injuries inside the human body.
Worldwide Semiconductor Revenue to Decline 9.6% in 2019
Worldwide semiconductor revenue is forecast to total $429 billion in 2019, a decline of 9.6% from $475 billion in 2018, according to Gartner, Inc.
Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018
Year-to-year sales down across all regions; 2019 Q2 sales up slightly compared to Q1.
Cree and ON Semiconductor Announce Multi-Year Silicon Carbide Wafer Supply Agreement
Agreement to boost commercial expansion of SiC in automotive and industrial applications.
Toshiba Memory Unveils New Technology for Removable NVMe Memory Devices with Groundbreaking Size to Performance Ratio
Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices.
