Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Fragmented Magnetism

Probing the properties of a Mott insulator, a team of researchers from Boston College, MIT, and U.C. Santa Barbara has revealed an elusive atomic-scale magnetic signal in the unique material as it transitions from insulator to a metal, the team reported recently in the journal Nature Physics. Working with a compound in the class of materials known as Mott insulators, the team used spin-polarizing scanning tunneling microscopy (SP-STM) to detail at the atomic level the underlying physics of one example of these insulators, which can be manipulated into a metallic state through the addition of an electronic charge, a process called doping, said Boston College Assistant Professor of Physics Ilija Zeljkovic, a lead author of the report.

Achieving Quantum Supremacy

Researchers in UC Santa Barbara/Google scientist John Martinis’ group have made good on their claim to quantum supremacy. Using 53 entangled quantum bits (“qubits”), their Sycamore computer has taken on — and solved — a problem considered intractable for classical computers. The milestone comes after roughly two decades of quantum computing research conducted by Martinis and his group, from the development of a single superconducting qubit to systems including architectures of 72 and, with Sycamore, 54 qubits (one didn’t perform) that take advantage of the both awe-inspiring and bizarre properties of quantum mechanics.

Combination of Nanometrics and Rudolph Technologies to Create Onto Innovation

Nanometrics Incorporated (NASDAQ: NANO) and Rudolph Technologies, Inc. (NYSE: RTEC), today announced that their combined company will be named Onto Innovation Inc., following the close of their previously announced merger of equals. The name Onto Innovation reflects the combined company’s anticipated focus on the future and exciting challenges ahead, highlighting the increasing importance of innovation in enabling that future for the company and its broader served markets. Onto Innovation will bring a breadth of perspective across the entire semiconductor value chain to innovate and enable its customers to solve their most difficult yield, device performance, quality, and reliability issues.

NSITEXE Achieves First-Pass Silicon Success for High-Performance Data Flow Processor-based SoC Test Chip Using DesignWare IP

Synopsys, Inc. (Nasdaq: SNPS) today announced that NSITEXE, a Denso Group Company, achieved first-pass silicon success for its high-performance Data Flow Processor (DFP)-based SoC test chip using Synopsys’ DesignWare® Interface and Foundation IP portfolios. With Synopsys’ silicon-proven DesignWare IP, NSITEXE met the advanced functionality, processing, performance, and testability requirements of its DFP-based SoC. NSITEXE’s DFP-based SoC combines both a CPU and a GPU to process large and complex datasets for parallel data management with power-efficient parallelism and quality.

OneSpin Shows How to Achieve IC Integrity at DVCon Europe

OneSpin® Solutions, provider of certified IC integrity verification solutions for building functionally correct, safe, secure and trusted integrated circuits, will present its verification expertise through a tutorial, technical session and an exhibit at DVCon Europe, being held October 29 – 30, 2019 at the Holiday Inn Munich City Centre, Munich, Germany.

Power Integrations Announces Settlement of Patent Litigation

Power Integrations (Nasdaq: POWI) today announced a comprehensive settlement of its patent disputes with ON Semiconductor and its subsidiary, Fairchild Semiconductor. Consistent with the terms of the term sheet disclosed on October 9, the companies have entered into a definitive agreement that ends all litigation between them, including lawsuits in Delaware, California, Taiwan and China. Power Integrations (PI) has received a cash payment of $175M from ON; neither company granted any licenses to the other.

Dr. Necip Sayiner Joins Rambus Board of Directors

Rambus Inc. (NASDAQ: RMBS), a silicon IP and chip provider dedicated to delivering data faster and safer, today announced the appointment of Dr. Necip Sayiner to its Board of Directors, effective immediately. With over twenty-five years of semiconductor expertise, Dr. Sayiner is an experienced executive with a proven track record of successfully increasing company revenue growth and profitability. Prior to joining the Rambus board, he was executive vice president and general manager at Renesas Electronics Corporation, following their acquisition of Intersil, where he served as president and CEO.

Renesas Expands Access to Portfolio of Leading-Edge IP Licenses

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced expanded access to its highly sought portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customer requirements in a rapidly changing industry. Starting today, customers will have access to IPs such as advanced 7nm (nanometer) SRAM and TCAM, and leading-edge standard Ethernet time-sensitive networking (TSN) IP. Furthermore, Renesas is working on providing a system IP which includes PIM (processing in memory), which attracted attention as an AI accelerator, presented in a conference paper in June 2019.

Micron Brings 3D XPoint Technology to Market With the World’s Fastest SSD

Micron Technology, Inc. (Nasdaq: MU), today announced a breakthrough in nonvolatile memory technology with the introduction of the world’s fastest SSD, the Micron X100 SSD. The Micron X100 SSD is the first solution in a family of products from Micron targeting storage- and memory-intensive applications for the data center. These solutions will leverage the strengths of 3D XPoint technology and usher in a new tier in the memory-to-storage hierarchy with higher capacity and persistence than DRAM, along with higher endurance and performance than NAND.

StratEdge Offers Assembly Services for Die Attachment on CMC Tabs

StratEdge Corporation announced its assembly services for attaching gallium nitride (GaN) and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) onto copper-molybdenum-copper (CMC) tabs. StratEdge’s proprietary eutectic die attach method maximizes the power output a chip can achieve, optimizing its performance and providing an efficient way to dissipate heat to avoid overheating and failures during normal operation.