The Semiconductor Industry Association (SIA) today announced Dr. Robert H. Dennard, pioneer of transformational breakthroughs in semiconductor technology and IBM Fellow Emeritus, has been named the 2019 recipient of SIA’s highest honor, the Robert N. Noyce Award.
Alpha and Omega Semiconductor Releases 700V and 600V αMOS5 Super Junction MOSFETs in 300mm Fab
Alpha and Omega Semiconductor, a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today announced the release of 700V and 600V αMOS5 Super Junction MOSFET families in 300mm technologies.
Researchers Teleport Information Within a Diamond
Researchers from the Yokohama National University have teleported quantum information securely within the confines of a diamond. The study has big implications for quantum information technology – the future of how sensitive information is shared and stored.
Emerging Semiconductor Substrates: What Will Be The Next Game-Changer?
Yole Développement (Yole) expects the emerging semiconductor substrate market to surpass US$400 million, growing at a 24% CAGR between 2018 and 2024.
MEMS Manufacturing for 2020 and Beyond
With so much growth ahead of us, how will the design and manufacture of MEMS keep pace with industry demand for higher levels of innovation and integration, lower cost and lower power, smaller footprints, and faster design cycles — all while meeting acceptable price points?
IEEE Approves New Power Modeling Standard
Silicon Integration Initiative has announced that its Unified Power Model, developed with major contributions from IBM and GLOBALFOUNDRIES, has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018 Standard for Design and Verification of Low-Power, Energy-Aware Electronic Systems.
Applying Pressure Is Way Toward Generating More Electricity From Waste Heat
Osaka University-led researchers apply pressure to a thermoelectric material to better understand quantum phenomena and in doing so are able to increase the material’s ability to produce electricity from waste heat by 100%.
CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments
Leti, a research institute of CEA Tech, and Radiall, a global manufacturer of leading-edge interconnect solutions, announced a five-year common lab to design innovative antennas, radio frequency (RF) to meet infrastructure requirements of 5G networks and photonics components for harsh environments.
SEMI Teams with Cornell University To Accelerate Technology Development Using Machine Learning and AI
SEMI today announced a research and development (R&D) project to speed technology progress and problem-solving in microelectronics manufacturing and across the supply chain by driving new efficiencies using machine learning (ML) and artificial intelligence (AI).
Lattice Semiconductor Wins AI Breakthrough Award
Lattice Semiconductor Corporation announced the company’s popular Lattice sensAI solutions stack was named “Best AI-Based Solution for Engineering” in the 2019 AI Breakthrough Awards.
