SEMICON West participants will gain first look at Quantum Economic Development Consortium (QED-C) roadmapping activities devoted to the pursuit of U.S. leadership in the rapidly emerging global quantum industry.
CEA’s Precise Localization Technology Boosts Quality Control and Efficiency in Desoutter’s Products
Desoutter Industrial Tools and CEA-Leti today announced a precise, new indoor-location system that enables factories to monitor tools in real time and help manage their use by workers to improve efficiency, safety, security and quality control on assembly lines.
Air Products Awarded Contract to Supply MEMC Korea’s New 300mm Silicon Wafer Fab in Cheonan, South Korea
Air Products today announced it has been awarded a contract by MEMC Korea to supply a new 300mm silicon wafer fab being built adjacent to its existing fab in Cheonan, South Korea.
Shell Increases Versatility of Nanowires
Laboratory experiments show that semiconductor nanowires can be tuned over wide energy ranges.
NXP Semiconductors Appoints Three New Non-Executive Directors
NXP Semiconductors N.V. announced the results of its Annual General Meeting of Shareholders, held on June 17, 2019 in Amsterdam.
TDK Announces Worldwide Availability of MEMS-Based “Sonar on a Silicon Chip” Ultrasonic Time-of-Flight Sensors
This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view.
Rahul Goyal of Intel Re-elected Board Chair of Silicon Integration Initiative
Rahul Goyal of Intel has been reelected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
Littelfuse Breaks Ground on New Power Semiconductor Assembly Facility
New facility in Philippines reinforces commitment to power semiconductor growth with capabilities and additional capacity to fuel sustained output and innovation.
A New ‘Golden’ Age For Electronics?
Scientists at Nagoya University, Japan, have created materials that shrink uniformly in all directions when heated under normal everyday conditions, using a cheap and industrially scalable process. This potentially opens up a new paradigm of thermal-expansion control that will make electronic devices more resilient to temperature changes.
Machine Learning Reveals How Strongly Interacting Electrons Behave At Atomic Level
Machine learning helps solve a puzzle of how strongly interacting electrons behave at atomic level.
